Akira Yabushita

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,901,958
- Issue date Mar 8, 2011
- Renesas Electronics Corporation
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,351,597
- Issue date Apr 1, 2008
- Renesas Technology Corp.
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,219,422
- Issue date May 22, 2007
- Renesas Technology Corp.
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Grant
Wiring board and gas discharge type display apparatus using the same
- Patent number 6,652,342
- Issue date Nov 25, 2003
- Hitachi, Ltd.
- Masashi Nishiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making gas discharge display panel and gas discharge disp...
- Patent number 6,624,575
- Issue date Sep 23, 2003
- Hitachi, Ltd.
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and gas discharge display device
- Patent number 6,621,217
- Issue date Sep 16, 2003
- Hitachi, Ltd.
- Masashi Nishiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas discharge display panel and gas discharge display device having...
- Patent number 6,429,586
- Issue date Aug 6, 2002
- Hitachi, Ltd.
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and gas discharge display device that includes a d...
- Patent number 6,346,772
- Issue date Feb 12, 2002
- Hitachi, Ltd.
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making gas discharge display panel and gas discharge disp...
- Patent number 6,343,967
- Issue date Feb 5, 2002
- Hitachi, Ltd.
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and gas discharge display device and method therefor
- Patent number 6,261,144
- Issue date Jul 17, 2001
- Hitachi, Ltd.
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 5,958,600
- Issue date Sep 28, 1999
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with metal layer for solder bonding and electronic ci...
- Patent number 5,476,726
- Issue date Dec 19, 1995
- Hitachi, Ltd.
- Masahide Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film resistor and wiring board using the same
- Patent number 5,235,313
- Issue date Aug 10, 1993
- Hitachi, Ltd.
- Yasunori Narizuka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Circuit substrate and thermal printing head using the same
- Patent number 4,806,725
- Issue date Feb 21, 1989
- Hitachi, Ltd.
- Yasunori Narizuka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Thermal printhead
- Patent number 4,343,986
- Issue date Aug 10, 1982
- Hitachi, Ltd.
- Masao Mitani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110175634
- Publication date Jul 21, 2011
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110136272
- Publication date Jun 9, 2011
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM
- Publication number 20110014727
- Publication date Jan 20, 2011
- Akira Yabushita
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100304510
- Publication date Dec 2, 2010
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
THIN-FILM PROBE SHEET AND METHOD OF MANUFACTURING THE SAME, PROBE C...
- Publication number 20100301884
- Publication date Dec 2, 2010
- Etsuko Takane
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20080020498
- Publication date Jan 24, 2008
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20070218572
- Publication date Sep 20, 2007
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Application
Thin film probe sheet and semiconductor chip inspection system
- Publication number 20060094162
- Publication date May 4, 2006
- Akira Yabushita
- G01 - MEASURING TESTING
Information Patent Application
Connecting apparatus, semiconductor chip inspecting apparatus, and...
- Publication number 20060043593
- Publication date Mar 2, 2006
- Terutaka Mori
- G01 - MEASURING TESTING
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20050093565
- Publication date May 5, 2005
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20040183556
- Publication date Sep 23, 2004
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Application
Method of making gas discharge display panel and gas discharge disp...
- Publication number 20020089285
- Publication date Jul 11, 2002
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate and gas discharge display device
- Publication number 20020070665
- Publication date Jun 13, 2002
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate and gas discharge display device
- Publication number 20020014841
- Publication date Feb 7, 2002
- Masashi Nishiki
- H01 - BASIC ELECTRIC ELEMENTS

Akira Yabushita

Person

Patents Grantslast 30 patents

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Wiring board and gas discharge type display apparatus using the same

Method of making gas discharge display panel and gas discharge disp...

Wiring substrate and gas discharge display device

Gas discharge display panel and gas discharge display device having...

Wiring substrate and gas discharge display device that includes a d...

Method of making gas discharge display panel and gas discharge disp...

Wiring substrate and gas discharge display device and method therefor

Circuit board and method of manufacturing the same

Circuit board with metal layer for solder bonding and electronic ci...

Thin film resistor and wiring board using the same

Circuit substrate and thermal printing head using the same

Thermal printhead

Patents Applicationslast 30 patents

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

THIN-FILM PROBE SHEET AND METHOD OF MANUFACTURING THE SAME, PROBE C...

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Thin film probe sheet and semiconductor chip inspection system

Connecting apparatus, semiconductor chip inspecting apparatus, and...

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Method of making gas discharge display panel and gas discharge disp...

Wiring substrate and gas discharge display device

Wiring substrate and gas discharge display device