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Akira Yamauchi

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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip bonding apparatus
    • Patent number 6,648,045
    • Issue date Nov 18, 2003
    • Toray Engineering Co., Ltd.
    • Akira Yamauchi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Joining apparatus
    • Publication number 20060054283
    • Publication date Mar 16, 2006
    • Toray Engineering Co., Ltd.
    • Akira Yamauchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Joining method using anisotropic conductive adhesive
    • Publication number 20040177921
    • Publication date Sep 16, 2004
    • Akira Yamauchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and device for installation
    • Publication number 20040169020
    • Publication date Sep 2, 2004
    • Akira Yamauchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stacked wafer aligment method
    • Publication number 20040023466
    • Publication date Feb 5, 2004
    • Akira Yamauchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip bonding device
    • Publication number 20020189767
    • Publication date Dec 19, 2002
    • Akira Yamauchi
    • H01 - BASIC ELECTRIC ELEMENTS