Akira Yamauchi

Person

Uji-City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding device
- Patent number 12,094,747
- Issue date Sep 17, 2024
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate joining method, substrate joining system and method for c...
- Patent number 11,837,444
- Issue date Dec 5, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifying device and audio system
- Patent number 11,437,958
- Issue date Sep 6, 2022
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifying device and audio equipment
- Patent number 11,171,617
- Issue date Nov 9, 2021
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PWM modulator
- Patent number 10,581,422
- Issue date Mar 3, 2020
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 10,204,785
- Issue date Feb 12, 2019
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 10,166,749
- Issue date Jan 1, 2019
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 9,870,922
- Issue date Jan 16, 2018
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current feedback output circuit
- Patent number 9,692,371
- Issue date Jun 27, 2017
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 9,601,350
- Issue date Mar 21, 2017
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure application apparatus and pressure application method
- Patent number 9,379,082
- Issue date Jun 28, 2016
- BONDTECH CO., LTD.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure application apparatus and pressure application method
- Patent number 9,243,894
- Issue date Jan 26, 2016
- BONDTECH CO., LTD.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current feedback output circuit
- Patent number 9,083,295
- Issue date Jul 14, 2015
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifying apparatus and audio system
- Patent number 8,908,886
- Issue date Dec 9, 2014
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit device and audio system
- Patent number 8,050,423
- Issue date Nov 1, 2011
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Alignment method and mounting method using the alignment method
- Patent number 7,918,953
- Issue date Apr 5, 2011
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for bonding a metal on a surface of a substrate
- Patent number 7,591,293
- Issue date Sep 22, 2009
- Toray Engineering Co., Ltd.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration method in a chip mounting device
- Patent number 7,341,877
- Issue date Mar 11, 2008
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment method and mounting method using the alignment method
- Patent number 7,299,545
- Issue date Nov 27, 2007
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method and mounting device
- Patent number 7,279,358
- Issue date Oct 9, 2007
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting device
- Patent number 6,993,832
- Issue date Feb 7, 2006
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high-speed and accurate alignment using a chip mounting d...
- Patent number 6,961,994
- Issue date Nov 8, 2005
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting a chip
- Patent number 6,913,945
- Issue date Jul 5, 2005
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting device
- Patent number 6,892,447
- Issue date May 17, 2005
- Toray Engineering Company, Limited
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment device
- Patent number 6,825,915
- Issue date Nov 30, 2004
- Toray Engeneering Co., Ltd.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool for thermo-compression-bonding chips, and chip packaging devic...
- Patent number 6,821,381
- Issue date Nov 23, 2004
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounting device and callibration method therein
- Patent number 6,811,627
- Issue date Nov 2, 2004
- Toray Engineering Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AMPLIFIER CIRCUIT AND SYSTEM
- Publication number 20240313720
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Akira YAMAUCHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
- Publication number 20240304594
- Publication date Sep 12, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240174457
- Publication date May 30, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240162063
- Publication date May 16, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079373
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079374
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDER, AND BONDING SYSTEM
- Publication number 20240066624
- Publication date Feb 29, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM
- Publication number 20240009984
- Publication date Jan 11, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
AMPLIFIER CIRCUIT AND SENSOR CIRCUIT
- Publication number 20230318550
- Publication date Oct 5, 2023
- Kabushiki Kaisha Toshiba
- Akira YAMAUCHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP BONDING SYSTEM AND CHIP BONDING METHOD
- Publication number 20230307284
- Publication date Sep 28, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20230154770
- Publication date May 18, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR C...
- Publication number 20230136771
- Publication date May 4, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFYING DEVICE
- Publication number 20230091797
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING DEVICE
- Publication number 20210320024
- Publication date Oct 14, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD
- Publication number 20210313211
- Publication date Oct 7, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFYING DEVICE AND AUDIO SYSTEM
- Publication number 20210297045
- Publication date Sep 23, 2021
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20210265300
- Publication date Aug 26, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFYING DEVICE AND AUDIO EQUIPMENT
- Publication number 20200162040
- Publication date May 21, 2020
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20200006099
- Publication date Jan 2, 2020
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PWM MODULATOR
- Publication number 20180076806
- Publication date Mar 15, 2018
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20180068854
- Publication date Mar 8, 2018
- BONDTECH CO., LTD.
- Tadatomo SUGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
- Publication number 20170221856
- Publication date Aug 3, 2017
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20170047225
- Publication date Feb 16, 2017
- BONDTECH CO., LTD.
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD
- Publication number 20160084638
- Publication date Mar 24, 2016
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- G01 - MEASURING TESTING
Information Patent Application
CURRENT FEEDBACK OUTPUT CIRCUIT
- Publication number 20150270815
- Publication date Sep 24, 2015
- Kabushiki Kaisha Toshiba
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT FEEDBACK OUTPUT CIRCUIT
- Publication number 20140167850
- Publication date Jun 19, 2014
- KABUSHIKI KAISHA TOSHIBA
- Akira Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140048805
- Publication date Feb 20, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140037945
- Publication date Feb 6, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B32 - LAYERED PRODUCTS

Akira Yamauchi

Person

Patents Grantslast 30 patents

Substrate bonding device

Substrate joining method, substrate joining system and method for c...

Component mounting system

Power amplifying device and audio system

Power amplifying device and audio equipment

Method for bonding substrates together, and substrate bonding device

PWM modulator

Substrate bonding apparatus and substrate bonding method

Bonding-substrate fabrication method, bonding substrate, substrate...

Substrate bonding apparatus and substrate bonding method

Current feedback output circuit

Bonding-substrate fabrication method, bonding substrate, substrate...

Pressure application apparatus and pressure application method

Pressure application apparatus and pressure application method

Chip-on-wafer bonding method and bonding device, and structure comp...

Current feedback output circuit

Power amplifying apparatus and audio system

Integrated circuit device and audio system

Alignment method and mounting method using the alignment method

Device for bonding a metal on a surface of a substrate

Calibration method in a chip mounting device

Alignment method and mounting method using the alignment method

Mounting method and mounting device

Chip mounting device

Method of high-speed and accurate alignment using a chip mounting d...

Method of mounting a chip

Chip mounting device

Alignment device

Tool for thermo-compression-bonding chips, and chip packaging devic...

Chip mounting device and callibration method therein

Patents Applicationslast 30 patents

AMPLIFIER CIRCUIT AND SYSTEM

BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM

BONDING SYSTEM AND BONDING METHOD

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

BONDING METHOD, BONDER, AND BONDING SYSTEM

SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM

AMPLIFIER CIRCUIT AND SENSOR CIRCUIT

CHIP BONDING SYSTEM AND CHIP BONDING METHOD

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR C...

POWER AMPLIFYING DEVICE

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

SUBSTRATE BONDING DEVICE

COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD

POWER AMPLIFYING DEVICE AND AUDIO SYSTEM

BONDING SYSTEM AND BONDING METHOD

POWER AMPLIFYING DEVICE AND AUDIO EQUIPMENT

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

PWM MODULATOR

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD

CURRENT FEEDBACK OUTPUT CIRCUIT

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

CURRENT FEEDBACK OUTPUT CIRCUIT

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...