Akira Yoshizumi

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polymeric composition for packaging a semiconductor electronic devi...
- Patent number 6,645,643
- Issue date Nov 11, 2003
- STMicroelectronics S.r.l.
- Roberto Zafarana
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Transparent conductive substrate and display apparatus
- Patent number 5,907,382
- Issue date May 25, 1999
- Kabushiki Kaisha Toshiba
- Sadao Kajiura
- G02 - OPTICS
Information Patent Grant
Color developing organic material, color developing resin compositi...
- Patent number 5,853,952
- Issue date Dec 29, 1998
- Kabushiki Kaisha Toshiba
- Toru Ushirogouchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a castable epoxy resin composition comprisi...
- Patent number 5,747,557
- Issue date May 5, 1998
- Kabushiki Kaisha Toshiba
- Koshi Hanyu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plastic-encapsulated semiconductor device
- Patent number 5,641,997
- Issue date Jun 24, 1997
- Kabushiki Kaisha Toshiba
- Hideo Ohta
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition
- Patent number 5,637,667
- Issue date Jun 10, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition
- Patent number 5,438,113
- Issue date Aug 1, 1995
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polysilane monomolecular film and polysilane built-up film
- Patent number 5,362,559
- Issue date Nov 8, 1994
- Kabushiki Kaisha Toshiba
- Shuji Hayase
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Polysilane and polysilane composition
- Patent number 5,336,736
- Issue date Aug 9, 1994
- Kabushiki Kaisha Toshiba
- Yoshihiko Nakano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 5,325,583
- Issue date Jul 5, 1994
- Kabushiki Kaisha Toshiba
- Seizaburo Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maleimide resin composition and resin encapsulated semiconductor de...
- Patent number 5,272,377
- Issue date Dec 21, 1993
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device encapsulant
- Patent number 5,258,426
- Issue date Nov 2, 1993
- Kabushiki Kaisha Toshiba
- Ken Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding resin composition and molded electronic component
- Patent number 5,252,639
- Issue date Oct 12, 1993
- Kabushiki Kaisha Toshiba
- Shinetsu Fujieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Rubber-modified phenolic resin composition and method of manufactur...
- Patent number 5,216,077
- Issue date Jun 1, 1993
- Kabushiki Kaisha Toshiba
- Akira Yoshizumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and a resin-sealed semiconductor device
- Patent number 5,043,211
- Issue date Aug 27, 1991
- Kabushiki Kaisha Toshiba
- Akira Yoshizumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Rubber-modified phenolic resin composition and method of manufactur...
- Patent number 4,916,174
- Issue date Apr 10, 1990
- Kabushiki Kaisha Toshiba
- Akira Yoshizumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for encapsulation of semi-conductor device
- Patent number 4,719,255
- Issue date Jan 12, 1988
- Kabushiki Kaisha Toshiba
- Akira Yoshizumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 4,248,920
- Issue date Feb 3, 1981
- Tokyo Shibaura Denki Kabushiki Kaisha
- Akira Yoshizumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Polymeric composition for packaging a semiconductor electronic devi...
- Publication number 20020022679
- Publication date Feb 21, 2002
- STMicroelectronics S.r.l.
- Roberto Zafarana
- H01 - BASIC ELECTRIC ELEMENTS

Akira Yoshizumi

Person

Patents Grantslast 30 patents

Polymeric composition for packaging a semiconductor electronic devi...

Transparent conductive substrate and display apparatus

Color developing organic material, color developing resin compositi...

Method of manufacturing a castable epoxy resin composition comprisi...

Plastic-encapsulated semiconductor device

Thermosetting resin composition

Thermosetting resin composition

Polysilane monomolecular film and polysilane built-up film

Polysilane and polysilane composition

Method for manufacturing printed circuit board

Maleimide resin composition and resin encapsulated semiconductor de...

Semiconductor device encapsulant

Molding resin composition and molded electronic component

Rubber-modified phenolic resin composition and method of manufactur...

Epoxy resin composition and a resin-sealed semiconductor device

Rubber-modified phenolic resin composition and method of manufactur...

Epoxy resin composition for encapsulation of semi-conductor device

Resin-sealed semiconductor device

Patents Applicationslast 30 patents

Polymeric composition for packaging a semiconductor electronic devi...