Akitoshi Hara

Person

Nagano-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Piezoelectric device with a package including a convex part
- Patent number 9,325,292
- Issue date Apr 26, 2016
- Seiko Epson Corporation
- Katsuo Ishikawa
- G01 - MEASURING TESTING
Information Patent Grant
Piezoelectric device with a package including a convex part
- Patent number 8,723,401
- Issue date May 13, 2014
- Seiko Epson Corporation
- Katsuo Ishikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric device with a package including a convex part
- Patent number 8,643,254
- Issue date Feb 4, 2014
- Seiko Epson Corporation
- Katsuo Ishikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device, electronic module, and methods for manufacturing...
- Patent number 8,248,813
- Issue date Aug 21, 2012
- Seiko Epson Corporation
- Atsushi Ono
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device, electronic module, and methods for manufacturing...
- Patent number 7,933,128
- Issue date Apr 26, 2011
- Epson Toyocom Corporation
- Atsushi Ono
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric resonator, manufacturing method thereof and lid for p...
- Patent number 7,859,172
- Issue date Dec 28, 2010
- Epson Toyocom Corporation
- Katsuo Ishikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric resonator and manufacturing method therefor
- Patent number 7,714,484
- Issue date May 11, 2010
- Epson Toyocom Corporation
- Akitoshi Hara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Piezoelectric device
- Patent number D580592
- Issue date Nov 11, 2008
- Epson Toyocom Corporation
- Akitoshi Hara
- D27 - Tobacco and smokers' supplies
Information Patent Grant
Piezoelectric device
- Patent number D580096
- Issue date Nov 4, 2008
- Epson Toyocom Corporation
- Akitoshi Hara
- D27 - Tobacco and smokers' supplies
Information Patent Grant
Methods for manufacturing semiconductor chips, methods for manufact...
- Patent number 6,900,076
- Issue date May 31, 2005
- Seiko Epson Corporation
- Tadashi Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 6,566,232
- Issue date May 20, 2003
- Seiko Epson Corporation
- Akitoshi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 5,498,902
- Issue date Mar 12, 1996
- Seiko Epson Corporation
- Akitoshi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sealing mold
- Patent number 5,302,850
- Issue date Apr 12, 1994
- Seiko Epson Corporation
- Akitoshi Hara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of encapsulating a semiconductor element using a resin mold...
- Patent number 5,077,237
- Issue date Dec 31, 1991
- Seiko Epson Corporation
- Akitoshi Hara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC DEVICE WITH A PACKAGE INCLUDING A CONVEX PART
- Publication number 20140202245
- Publication date Jul 24, 2014
- SEIKO EPSON CORPORATION
- Katsuo ISHIKAWA
- G01 - MEASURING TESTING
Information Patent Application
PIEZOELECTRIC DEVICE WITH A PACKAGE INCLUDING A CONVEX PART
- Publication number 20140015618
- Publication date Jan 16, 2014
- SEIKO EPSON CORPORATION
- Katsuo ISHIKAWA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING...
- Publication number 20110162452
- Publication date Jul 7, 2011
- EPSON TOYOCOM CORPORATION
- Atsushi ONO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC DEVICE
- Publication number 20110133605
- Publication date Jun 9, 2011
- SEIKO EPSON CORPORATION
- Katsuo ISHIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20100180415
- Publication date Jul 22, 2010
- EPSON TOYOCOM CORPORATION
- Akitoshi Hara
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING...
- Publication number 20090095510
- Publication date Apr 16, 2009
- EPSON TOYOCOM CORPORATION
- Atsushi ONO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20090001856
- Publication date Jan 1, 2009
- EPSON TOYOCOM CORPORATION
- Akitoshi HARA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PIEZOELECTRIC RESONATOR, MANUFACTURING METHOD THEREOF AND LID FOR P...
- Publication number 20080315727
- Publication date Dec 25, 2008
- EPSON TOYOCOM CORPORATION
- Katsuo Ishikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Methods for manufacturing semiconductor chips, methods for manufact...
- Publication number 20010021582
- Publication date Sep 13, 2001
- Tadashi Komiyama
- H01 - BASIC ELECTRIC ELEMENTS

Akitoshi Hara

Person

Patents Grantslast 30 patents

Piezoelectric device with a package including a convex part

Piezoelectric device with a package including a convex part

Piezoelectric device with a package including a convex part

Electronic device, electronic module, and methods for manufacturing...

Electronic device, electronic module, and methods for manufacturing...

Piezoelectric resonator, manufacturing method thereof and lid for p...

Piezoelectric resonator and manufacturing method therefor

Piezoelectric device

Piezoelectric device

Methods for manufacturing semiconductor chips, methods for manufact...

Method of fabricating semiconductor device

Semiconductor device and its manufacturing method

Semiconductor sealing mold

Method of encapsulating a semiconductor element using a resin mold...

Patents Applicationslast 30 patents

PIEZOELECTRIC DEVICE WITH A PACKAGE INCLUDING A CONVEX PART

PIEZOELECTRIC DEVICE WITH A PACKAGE INCLUDING A CONVEX PART

ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING...

PIEZOELECTRIC DEVICE

PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREFOR

ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING...

PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREFOR

PIEZOELECTRIC RESONATOR, MANUFACTURING METHOD THEREOF AND LID FOR P...

Methods for manufacturing semiconductor chips, methods for manufact...