Akitoshi Suzuki

Person

Nikko, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper foil, method of producing electrolytic copper f...
- Patent number 9,966,608
- Issue date May 8, 2018
- Furukawa Electric Co., Ltd.
- Kensaku Shinozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolysis copper-alloy foil, method of the same, electrolytic-so...
- Patent number 9,890,463
- Issue date Feb 13, 2018
- Furukawa Electric Co., Ltd.
- Akitoshi Suzuki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Lithium-ion secondary battery, electrode for the secondary battery,...
- Patent number 9,603,245
- Issue date Mar 21, 2017
- Furukawa Electric Co., Ltd.
- Akitoshi Suzuki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High strength, high heat resistance electrodeposited copper foil an...
- Patent number 9,428,840
- Issue date Aug 30, 2016
- Furukawa Electric Co., Ltd.
- Takeshi Ezura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anode for secondary battery, anode current collector, production me...
- Patent number 9,293,771
- Issue date Mar 22, 2016
- Furukawa Electric Co., Ltd.
- Toshio Tani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Ultra-thin copper foil with carrier and printed wiring board using...
- Patent number 7,790,269
- Issue date Sep 7, 2010
- The Furukawa Electric Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultra-fine printed wiring board
- Patent number 7,175,920
- Issue date Feb 13, 2007
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for chip-on-film use, plasma display panel, or high-fre...
- Patent number 7,172,818
- Issue date Feb 6, 2007
- Furukawa Circuit Foil Co., Ltd.
- Tadao Nakaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite copper foil and manufacturing method thereof
- Patent number 7,153,590
- Issue date Dec 26, 2006
- Circuit Foil Luxembourg Trading Sarl
- Raymond Gales
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultrafine printed wiring boad
- Patent number 7,026,059
- Issue date Apr 11, 2006
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 6,835,442
- Issue date Dec 28, 2004
- Sony Chemicals Corp.
- Noriaki Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil for fine pattern and method for produc...
- Patent number 5,834,140
- Issue date Nov 10, 1998
- Circuit Foil Japan Co., Ltd.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Split die for holding work during bending operation
- Patent number 4,722,214
- Issue date Feb 2, 1988
- Murata Kikai Kabushiki Kaisha
- Yukio Hayashi
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method for continuously electroplating wire or the like and apparat...
- Patent number 4,420,377
- Issue date Dec 13, 1983
- The Furukawa Electric Company, Ltd.
- Shoji Shiga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH STRENGTH, HIGH HEAT RESISTANCE ELECTRODEPOSITED COPPER FOIL AN...
- Publication number 20140291156
- Publication date Oct 2, 2014
- Takeshi Ezura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL, METHOD OF PRODUCING ELECTROLYTIC COPPER F...
- Publication number 20140199588
- Publication date Jul 17, 2014
- FURUKAWA ELECTRIC CO., LTD.
- Kensaku Shinozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYSIS COPPER-ALLOY FOIL, METHOD OF THE SAME, ELECTROLYTIC-SO...
- Publication number 20140045061
- Publication date Feb 13, 2014
- FURUKAWA ELECTRIC CO., LTD.
- Akitoshi SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LITHIUM-ION SECONDARY BATTERY, ELECTRODE FOR THE SECONDARY BATTERY,...
- Publication number 20140017564
- Publication date Jan 16, 2014
- FURUKAWA ELECTRIC CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODE FOR SECONDARY BATTERY, ANODE CURRENT COLLECTOR, PRODUCTION ME...
- Publication number 20130115510
- Publication date May 9, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Toshio TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL FOR LITHIUM ION...
- Publication number 20130108922
- Publication date May 2, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Kensaku Shinozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL AND METHOD FOR PRODUCING COPPER FOIL
- Publication number 20120258281
- Publication date Oct 11, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Kensaku Shinozaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING...
- Publication number 20090011271
- Publication date Jan 8, 2009
- Akitoshi SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite copper foil, method of production thereof and high freque...
- Publication number 20060147742
- Publication date Jul 6, 2006
- Akira Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultra-fine printed wiring board
- Publication number 20050249927
- Publication date Nov 10, 2005
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultra-thin copper foil with carrier and printed wiring board using...
- Publication number 20050158574
- Publication date Jul 21, 2005
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for chip-on-film use, plasma display panel, or high-fre...
- Publication number 20040043242
- Publication date Mar 4, 2004
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Tadao Nakaoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultrafine printed wiring boad
- Publication number 20040038049
- Publication date Feb 26, 2004
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited copper foil and electrodeposited copper foil for s...
- Publication number 20040029006
- Publication date Feb 12, 2004
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Hideo Otsuka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible printed wiring board
- Publication number 20030132192
- Publication date Jul 17, 2003
- Noriaki Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite copper foil and manufacturing method thereof
- Publication number 20030012975
- Publication date Jan 16, 2003
- Raymond Gales
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Akitoshi Suzuki

Person

Patents Grantslast 30 patents

Electrolytic copper foil, method of producing electrolytic copper f...

Electrolysis copper-alloy foil, method of the same, electrolytic-so...

Lithium-ion secondary battery, electrode for the secondary battery,...

High strength, high heat resistance electrodeposited copper foil an...

Anode for secondary battery, anode current collector, production me...

Ultra-thin copper foil with carrier and printed wiring board using...

Copper foil for high-density ultra-fine printed wiring board

Copper foil for chip-on-film use, plasma display panel, or high-fre...

Composite copper foil and manufacturing method thereof

Copper foil for high-density ultrafine printed wiring boad

Flexible printed wiring board

Electrodeposited copper foil for fine pattern and method for produc...

Split die for holding work during bending operation

Method for continuously electroplating wire or the like and apparat...

Patents Applicationslast 30 patents

HIGH STRENGTH, HIGH HEAT RESISTANCE ELECTRODEPOSITED COPPER FOIL AN...

ELECTROLYTIC COPPER FOIL, METHOD OF PRODUCING ELECTROLYTIC COPPER F...

ELECTROLYSIS COPPER-ALLOY FOIL, METHOD OF THE SAME, ELECTROLYTIC-SO...

LITHIUM-ION SECONDARY BATTERY, ELECTRODE FOR THE SECONDARY BATTERY,...

ANODE FOR SECONDARY BATTERY, ANODE CURRENT COLLECTOR, PRODUCTION ME...

ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL FOR LITHIUM ION...

COPPER FOIL AND METHOD FOR PRODUCING COPPER FOIL

ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING...

Composite copper foil, method of production thereof and high freque...

Copper foil for high-density ultra-fine printed wiring board

Ultra-thin copper foil with carrier and printed wiring board using...

Copper foil for chip-on-film use, plasma display panel, or high-fre...

Copper foil for high-density ultrafine printed wiring boad

Electrodeposited copper foil and electrodeposited copper foil for s...

Flexible printed wiring board

Composite copper foil and manufacturing method thereof