Akiyoshi Sawai

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,256,875
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,177,724
- Issue date Jan 23, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 6,046,071
- Issue date Apr 4, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device laminated printed circuit boards
- Patent number 6,005,289
- Issue date Dec 21, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device
- Patent number 5,903,048
- Issue date May 11, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Kouji Bandou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,834,340
- Issue date Nov 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chip
- Patent number 5,814,883
- Issue date Sep 29, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,710,062
- Issue date Jan 20, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 5,666,008
- Issue date Sep 9, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package
- Patent number 5,554,887
- Issue date Sep 10, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS

Akiyoshi Sawai

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Semiconductor device

Plastic molded semiconductor package and method of manufacturing th...

Package for semiconductor device laminated printed circuit boards

Lead frame for semiconductor device

Plastic molded semiconductor package and method of manufacturing th...

Packaged semiconductor chip

Plastic molded semiconductor package and method of manufacturing th...

Flip chip semiconductor device

Plastic molded semiconductor package