Akm Shaestagir CHOWDHURY

Person

PORTLAND, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 12,080,648
- Issue date Sep 3, 2024
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal structures, devices, and methods
- Patent number 11,769,729
- Issue date Sep 26, 2023
- Intel Corporation
- Daniel J. Zierath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of graphene on a dielectric surface for next generation...
- Patent number 11,251,129
- Issue date Feb 15, 2022
- Intel Corporation
- Nita Chandrasekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 11,195,798
- Issue date Dec 7, 2021
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...
- Publication number 20250006628
- Publication date Jan 2, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS
- Publication number 20230420361
- Publication date Dec 28, 2023
- Intel Corporation
- Nita CHANDRASEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS FILLING OF VARIABLE ASPECT RATIO SINGLE DAMASCENE CONT...
- Publication number 20230101107
- Publication date Mar 30, 2023
- Intel Corporation
- AKM Shaestagir CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF SELF-ASSEMBLED MONOLAYERS FOR IMPROVED VIA INTEGRATION
- Publication number 20220130721
- Publication date Apr 28, 2022
- Intel Corporation
- Guillaume Bouche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF GRAPHENE ON A DIELECTRIC SURFACE FOR NEXT GENERATION...
- Publication number 20220093514
- Publication date Mar 24, 2022
- Intel Corporation
- Nita CHANDRASEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES
- Publication number 20220059467
- Publication date Feb 24, 2022
- Intel Corporation
- Yang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF GRAPHENE ON A DIELECTRIC SURFACE FOR NEXT GENERATION...
- Publication number 20210305161
- Publication date Sep 30, 2021
- Intel Corporation
- Nita CHANDRASEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL STRUCTURES, DEVICES, AND METHODS
- Publication number 20190393156
- Publication date Dec 26, 2019
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES
- Publication number 20170018506
- Publication date Jan 19, 2017
- Intel Corporation
- Yang CAO
- H01 - BASIC ELECTRIC ELEMENTS

Akm Shaestagir CHOWDHURY

Person

Patents Grantslast 30 patents

Tungsten alloys in semiconductor devices

Metal structures, devices, and methods

Deposition of graphene on a dielectric surface for next generation...

Tungsten alloys in semiconductor devices

Patents Applicationslast 30 patents

CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...

SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS

SIMULTANEOUS FILLING OF VARIABLE ASPECT RATIO SINGLE DAMASCENE CONT...

APPLICATION OF SELF-ASSEMBLED MONOLAYERS FOR IMPROVED VIA INTEGRATION

DEPOSITION OF GRAPHENE ON A DIELECTRIC SURFACE FOR NEXT GENERATION...

TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES

DEPOSITION OF GRAPHENE ON A DIELECTRIC SURFACE FOR NEXT GENERATION...

METAL STRUCTURES, DEVICES, AND METHODS

TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES