Akshey Sehgal

Person

Malta, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure to reduce soft-fail incidence and meth...
- Patent number 10,818,557
- Issue date Oct 27, 2020
- GLOBALFOUNDRIES Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming smooth sidewall structures using spacer materials
- Patent number 10,714,380
- Issue date Jul 14, 2020
- GLOBALFOUNDRIES Inc.
- Ravi P. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect formation process using wire trench etch prior to via...
- Patent number 10,347,528
- Issue date Jul 9, 2019
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with chamfer-less vias multi-patterning and methods for for...
- Patent number 10,181,420
- Issue date Jan 15, 2019
- GLOBALFOUNDRIES Inc.
- Jason Eugene Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs with strained channels and reduced on state resistance
- Patent number 10,134,876
- Issue date Nov 20, 2018
- GLOBALFOUNDRIES Inc.
- Bharat V. Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar metrology pad adjacent a set of fins of a fin field effect t...
- Patent number 10,121,711
- Issue date Nov 6, 2018
- GLOBALFOUNDRIES Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including organic interlayer dielectric layers...
- Patent number 9,576,894
- Issue date Feb 21, 2017
- GLOBALFOUNDRIES, INC.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for back end of line integration
- Patent number 9,293,363
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling measurement of layer thicknesses of a plurality of layer...
- Patent number 9,281,249
- Issue date Mar 8, 2016
- GLOBALFOUNDRIES Inc.
- Alok Vaid
- G01 - MEASURING TESTING
Information Patent Grant
Planar metrology pad adjacent a set of fins of a fin field effect t...
- Patent number 9,129,905
- Issue date Sep 8, 2015
- GLOBALFOUNDRIES Inc.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar metrology pad adjacent a set of fins of a fin field effect t...
- Patent number 9,121,890
- Issue date Sep 1, 2015
- GLOBALFOUNDRIES Inc.
- Sipeng Gu
- G01 - MEASURING TESTING
Information Patent Grant
Methods and structures for back end of line integration
- Patent number 9,117,822
- Issue date Aug 25, 2015
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of forming fins at tight fin pitches
- Patent number 9,105,478
- Issue date Aug 11, 2015
- GLOBALFOUNDRIES Inc.
- Andy Wei
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of forming a FinFET semiconductor device with undoped fins
- Patent number 9,105,507
- Issue date Aug 11, 2015
- GLOBALFOUNDRIES Inc.
- Andy C. Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a finfet semiconductor device with undoped fins
- Patent number 8,969,932
- Issue date Mar 3, 2015
- GLOBALFOUNDRIES Inc.
- Andy C. Wei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
FinFET structure with multiple workfunctions and method for fabrica...
- Patent number 8,835,233
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES, INC.
- Andy C. Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SMOOTH SIDEWALL STRUCTURES
- Publication number 20200135545
- Publication date Apr 30, 2020
- GLOBALFOUNDRIES INC.
- Ravi P. SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE TO REDUCE SOFT-FAIL INCIDENCE AND METH...
- Publication number 20200013678
- Publication date Jan 9, 2020
- GLOBALFOUNDRIES INC.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFETs WITH STRAINED CHANNELS AND REDUCED ON STATE RESISTANCE
- Publication number 20180286982
- Publication date Oct 4, 2018
- GLOBALFOUNDRIES INC.
- Bharat V. KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH CHAMFER-LESS VIAS MULTI-PATTERNING AND METHODS FOR FOR...
- Publication number 20180226294
- Publication date Aug 9, 2018
- GLOBALFOUNDRIES INC.
- Jason Eugene STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR BACK END OF LINE INTEGRATION
- Publication number 20170025347
- Publication date Jan 26, 2017
- GLOBALFOUNDRIES INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING ORGANIC INTERLAYER DIELECTRIC LAYERS...
- Publication number 20160358851
- Publication date Dec 8, 2016
- GLOBALFOUNDRIES, Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR METROLOGY PAD ADJACENT A SET OF FINS IN A FIN FIELD EFFECT T...
- Publication number 20150348913
- Publication date Dec 3, 2015
- GLOBALFOUNDRIES INC.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR METROLOGY PAD ADJACENT A SET OF FINS OF A FIN FIELD EFFECT T...
- Publication number 20150340296
- Publication date Nov 26, 2015
- GLOBALFOUNDRIES INC.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR BACK END OF LINE INTEGRATION
- Publication number 20150332959
- Publication date Nov 19, 2015
- GLOBALFOUNDRIES INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING FINS AT TIGHT FIN PITCHES
- Publication number 20150287595
- Publication date Oct 8, 2015
- GLOBALFOUNDRIES INC.
- Andy WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIALLY CRYSTALLIZED FIN HARD MASK FOR FIN FIELD-EFFECT-TRANSISTO...
- Publication number 20150270175
- Publication date Sep 24, 2015
- GLOBALFOUNDRIES INC.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SOURCE/DRAIN REGIONS WITH SINGLE RETICLE AND RESULTING DEVICE
- Publication number 20150255353
- Publication date Sep 10, 2015
- GLOBALFOUNDRIES INC.
- Jing WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING MEASUREMENT OF LAYER THICKNESSES OF A PLURALITY OF LAYER...
- Publication number 20150198435
- Publication date Jul 16, 2015
- GLOBALFOUNDRIES INC.
- Alok VAID
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE WITH UNDOPED FINS
- Publication number 20150123214
- Publication date May 7, 2015
- GLOBALFOUNDRIES INC.
- Andy C. Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR METROLOGY PAD ADJACENT A SET OF FINS OF A FIN FIELD EFFECT T...
- Publication number 20150123212
- Publication date May 7, 2015
- GLOBALFOUNDRIES INC.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING FINS AT TIGHT FIN PITCHES
- Publication number 20150115418
- Publication date Apr 30, 2015
- GLOBALFOUNDRIES INC.
- Andy WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR METROLOGY PAD ADJACENT A SET OF FINS OF A FIN FIELD EFFECT T...
- Publication number 20150115267
- Publication date Apr 30, 2015
- GLOBALFOUNDRIES INC.
- Sipeng Gu
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE WITH UNDOPED FINS
- Publication number 20140159126
- Publication date Jun 12, 2014
- Andy C. Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURE WITH MULTIPLE WORKFUNCTIONS AND METHOD FOR FABRICA...
- Publication number 20140004692
- Publication date Jan 2, 2014
- GLOBALFOUNDRIES INC.
- Andy C. Wei
- H01 - BASIC ELECTRIC ELEMENTS

Akshey Sehgal

Person

Patents Grantslast 30 patents

Integrated circuit structure to reduce soft-fail incidence and meth...

Method of forming smooth sidewall structures using spacer materials

Interconnect formation process using wire trench etch prior to via...

Devices with chamfer-less vias multi-patterning and methods for for...

FinFETs with strained channels and reduced on state resistance

Planar metrology pad adjacent a set of fins of a fin field effect t...

Integrated circuits including organic interlayer dielectric layers...

Methods and structures for back end of line integration

Decoupling measurement of layer thicknesses of a plurality of layer...

Planar metrology pad adjacent a set of fins of a fin field effect t...

Planar metrology pad adjacent a set of fins of a fin field effect t...

Methods and structures for back end of line integration

Devices and methods of forming fins at tight fin pitches

Methods of forming a FinFET semiconductor device with undoped fins

Methods of forming a finfet semiconductor device with undoped fins

FinFET structure with multiple workfunctions and method for fabrica...

Patents Applicationslast 30 patents

SMOOTH SIDEWALL STRUCTURES

INTEGRATED CIRCUIT STRUCTURE TO REDUCE SOFT-FAIL INCIDENCE AND METH...

FINFETs WITH STRAINED CHANNELS AND REDUCED ON STATE RESISTANCE

DEVICES WITH CHAMFER-LESS VIAS MULTI-PATTERNING AND METHODS FOR FOR...

METHODS AND STRUCTURES FOR BACK END OF LINE INTEGRATION

INTEGRATED CIRCUITS INCLUDING ORGANIC INTERLAYER DIELECTRIC LAYERS...

PLANAR METROLOGY PAD ADJACENT A SET OF FINS IN A FIN FIELD EFFECT T...

PLANAR METROLOGY PAD ADJACENT A SET OF FINS OF A FIN FIELD EFFECT T...

METHODS AND STRUCTURES FOR BACK END OF LINE INTEGRATION

DEVICES AND METHODS OF FORMING FINS AT TIGHT FIN PITCHES

PARTIALLY CRYSTALLIZED FIN HARD MASK FOR FIN FIELD-EFFECT-TRANSISTO...

FORMING SOURCE/DRAIN REGIONS WITH SINGLE RETICLE AND RESULTING DEVICE

DECOUPLING MEASUREMENT OF LAYER THICKNESSES OF A PLURALITY OF LAYER...

METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE WITH UNDOPED FINS

PLANAR METROLOGY PAD ADJACENT A SET OF FINS OF A FIN FIELD EFFECT T...

DEVICES AND METHODS OF FORMING FINS AT TIGHT FIN PITCHES

PLANAR METROLOGY PAD ADJACENT A SET OF FINS OF A FIN FIELD EFFECT T...

METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE WITH UNDOPED FINS

FINFET STRUCTURE WITH MULTIPLE WORKFUNCTIONS AND METHOD FOR FABRICA...