Ala OMER

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Phoenix, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...
- Publication number 20240222089
- Publication date Jul 4, 2024
- Intel Corporation
- Ala OMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE
- Publication number 20240006296
- Publication date Jan 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006300
- Publication date Jan 4, 2024
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006285
- Publication date Jan 4, 2024
- The Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230185033
- Publication date Jun 15, 2023
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER
- Publication number 20230091834
- Publication date Mar 23, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE
- Publication number 20230090863
- Publication date Mar 23, 2023
- Intel Corporation
- Dilan SENEVIRATNE
- G02 - OPTICS
Information Patent Application
MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...
- Publication number 20230090188
- Publication date Mar 23, 2023
- Intel Corporation
- Junxin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...
- Publication number 20230086881
- Publication date Mar 23, 2023
- Intel Corporation
- Whitney BRYKS
- G02 - OPTICS

Person

Patents Applicationslast 30 patents

ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...

BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER

OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE

MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...

DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...