Alain Gueugnot

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Sassenage, FR

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding chips on a strained substrate and method of placi...
- Patent number 7,645,686
- Issue date Jan 12, 2010
- Commissariat a l'Energie Atomique
- Manuel Fendler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEM...
- Publication number 20150380395
- Publication date Dec 31, 2015
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS ON A STRAINED SUBSTRATE AND METHOD OF PLAC...
- Publication number 20090075423
- Publication date Mar 19, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Manuel Fendler
- H01 - BASIC ELECTRIC ELEMENTS