Alan B. Botula

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 11,152,495
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 11,081,572
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,629,710
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,600,893
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,109,553
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,068,827
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI-MOSFET gate insulation layer with different thickness
- Patent number 9,978,849
- Issue date May 22, 2018
- GLOBALFOUNDRIES Inc.
- Michel J. Abou-Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and method of manufacture
- Patent number 9,847,415
- Issue date Dec 19, 2017
- GLOBALFOUNDRIES Inc.
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,704,978
- Issue date Jul 11, 2017
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,666,701
- Issue date May 30, 2017
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,601,606
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Silicon-on-insulator heat sink
- Patent number 9,530,711
- Issue date Dec 27, 2016
- GLOBALFOUNDRIES Inc.
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode biased body contacted transistor
- Patent number 9,472,570
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES Inc.
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,324,628
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Forming structures on resistive substrates
- Patent number 9,257,324
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES Inc.
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin body switch transistor
- Patent number 9,214,561
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Michel J. Abou-Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High linearity SOI wafer for low-distortion circuit applications
- Patent number 9,165,819
- Issue date Oct 20, 2015
- GLOBALFOUNDRIES Inc.
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-linear kerf monitor and design structure thereof
- Patent number 9,070,651
- Issue date Jun 30, 2015
- International Business Machines Corporation
- Alan B. Botula
- G01 - MEASURING TESTING
Information Patent Grant
Silicon-on-insulator heat sink
- Patent number 9,059,269
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity silicon-on-insulator substrate and method of forming
- Patent number 8,963,293
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High linearity SOI wafer for low-distortion circuit applications
- Patent number 8,951,896
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and method of manufacture
- Patent number 8,921,190
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI radio frequency switch with enhanced signal fidelity and electr...
- Patent number 8,916,467
- Issue date Dec 23, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric lightly doped drain (LDD)...
- Patent number 8,912,597
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral extended drain metal oxide semiconductor field effect trans...
- Patent number 8,901,676
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Michel J. Abou-Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding for high-voltage semiconductor-on-insulator devices
- Patent number 8,890,246
- Issue date Nov 18, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI radio frequency switch with enhanced electrical isolation
- Patent number 8,866,226
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation for a charge in a silicon substrate
- Patent number 8,828,746
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble gas implantation region in top silicon layer of semiconductor...
- Patent number 8,748,285
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity silicon-on-insulator substrate and method of forming
- Patent number 8,741,739
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20200027973
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Alan B. BOTULA
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20190363182
- Publication date Nov 28, 2019
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20180331207
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Alan B. BOTULA
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20180294346
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR USING SELECTIVE UNDERCUT AT GATE CONDUCTOR AND GATE INSU...
- Publication number 20180204926
- Publication date Jul 19, 2018
- GLOBALFOUNDRIES INC.
- Michel J. Abou-Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20170200665
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR USING SELECTIVE UNDERCUT AT GATE CONDUCTOR AND GATE INSU...
- Publication number 20170186845
- Publication date Jun 29, 2017
- GLOBALFOUNDRIES INC.
- Michel J. Abou-Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20170117206
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20160204048
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20160204233
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20160126158
- Publication date May 5, 2016
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR HEAT SINK
- Publication number 20150255363
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20150243578
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE BIASED BODY CONTACTED TRANSISTOR
- Publication number 20150236040
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH LINEARITY SOI WAFER FOR LOW-DISTORTION CIRCUIT APPLICATIONS
- Publication number 20150072504
- Publication date Mar 12, 2015
- International Business Machines Corporation
- ALAN B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURE
- Publication number 20150041896
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH LINEARITY SOI WAFER FOR LOW-DISTORTION CIRCUIT APPLICATIONS
- Publication number 20150004778
- Publication date Jan 1, 2015
- International Business Machines Corporation
- ALAN B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN BODY SWITCH TRANSISTOR
- Publication number 20150001622
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Michel J. Abou-Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION FOR A CHARGE IN A SILICON SUBSTRATE
- Publication number 20140306325
- Publication date Oct 16, 2014
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING STRUCTURES ON RESISTIVE SUBSTRATES
- Publication number 20140213036
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR HEAT SINK
- Publication number 20140191322
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION FOR A CHARGE IN A SILICON SUBSTRATE
- Publication number 20140131800
- Publication date May 15, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RESISTIVITY SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING
- Publication number 20140124902
- Publication date May 8, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR (SOI) STRUCTURE CONFIGURED FOR REDUCED HARMONI...
- Publication number 20140004687
- Publication date Jan 2, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ASYMMETRIC LIGHTLY DOPED DRAIN (LDD)...
- Publication number 20130299903
- Publication date Nov 14, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW HARMONIC RF SWITCH IN SOI
- Publication number 20130214384
- Publication date Aug 22, 2013
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING
- Publication number 20130196493
- Publication date Aug 1, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RESISTIVITY SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING
- Publication number 20130168835
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR (SOI) STRUCTURE CONFIGURED FOR REDUCED HARMONI...
- Publication number 20130161618
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Structures on Resistive Substrates
- Publication number 20130140668
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS

Alan B. Botula

Person

Patents Grantslast 30 patents

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

SOI-MOSFET gate insulation layer with different thickness

Field effect transistor and method of manufacture

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Silicon-on-insulator heat sink

Diode biased body contacted transistor

Integrated circuit heat dissipation using nanostructures

Forming structures on resistive substrates

Thin body switch transistor

High linearity SOI wafer for low-distortion circuit applications

Non-linear kerf monitor and design structure thereof

Silicon-on-insulator heat sink

High resistivity silicon-on-insulator substrate and method of forming

High linearity SOI wafer for low-distortion circuit applications

Field effect transistor and method of manufacture

SOI radio frequency switch with enhanced signal fidelity and electr...

Semiconductor device including asymmetric lightly doped drain (LDD)...

Lateral extended drain metal oxide semiconductor field effect trans...

Shielding for high-voltage semiconductor-on-insulator devices

SOI radio frequency switch with enhanced electrical isolation

Compensation for a charge in a silicon substrate

Noble gas implantation region in top silicon layer of semiconductor...

High resistivity silicon-on-insulator substrate and method of forming

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

TRANSISTOR USING SELECTIVE UNDERCUT AT GATE CONDUCTOR AND GATE INSU...

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

TRANSISTOR USING SELECTIVE UNDERCUT AT GATE CONDUCTOR AND GATE INSU...

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

SILICON-ON-INSULATOR HEAT SINK

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

DIODE BIASED BODY CONTACTED TRANSISTOR

HIGH LINEARITY SOI WAFER FOR LOW-DISTORTION CIRCUIT APPLICATIONS

FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURE

HIGH LINEARITY SOI WAFER FOR LOW-DISTORTION CIRCUIT APPLICATIONS

THIN BODY SWITCH TRANSISTOR

COMPENSATION FOR A CHARGE IN A SILICON SUBSTRATE

FORMING STRUCTURES ON RESISTIVE SUBSTRATES

SILICON-ON-INSULATOR HEAT SINK

COMPENSATION FOR A CHARGE IN A SILICON SUBSTRATE

HIGH RESISTIVITY SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING

SILICON-ON-INSULATOR (SOI) STRUCTURE CONFIGURED FOR REDUCED HARMONI...

SEMICONDUCTOR DEVICE INCLUDING ASYMMETRIC LIGHTLY DOPED DRAIN (LDD)...

LOW HARMONIC RF SWITCH IN SOI

SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING

HIGH RESISTIVITY SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING

SILICON-ON-INSULATOR (SOI) STRUCTURE CONFIGURED FOR REDUCED HARMONI...

Forming Structures on Resistive Substrates