Alan Cuthbertson

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with simultaneous fabrication of dual damascene...
- Patent number 6,995,087
- Issue date Feb 7, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate aligned dual damascene openings
- Patent number 6,967,156
- Issue date Nov 22, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetal dielectric layer for integrated circuits
- Patent number 6,528,886
- Issue date Mar 4, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high-density plasma boron-containing silicate glass film...
- Patent number 6,500,771
- Issue date Dec 31, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Vladislav Vassiliev
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Intermetal dielectric layer for integrated circuits
- Patent number 6,451,687
- Issue date Sep 17, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form gate oxides of different thicknesses on a silicon su...
- Patent number 6,235,591
- Issue date May 22, 2001
- Chartered Semiconductor Manufacturing Company
- Narayanan Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit with simultaneous fabrication of dual damascene...
- Publication number 20040121585
- Publication date Jun 24, 2004
- Chartered Semiconductor Manufacturing LTD.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HDP SRO liner for beyond 0.18 um STI gap-fill
- Publication number 20040005781
- Publication date Jan 8, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Liu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermetal dielectric layer for integrated circuits
- Publication number 20020130418
- Publication date Sep 19, 2002
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS