Alan CUTHBERTSON

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective self-assembled monolayer patterning with sacrificial laye...
- Patent number 12,139,397
- Issue date Nov 12, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modification to rough polysilicon using ion implantation and silicide
- Patent number 11,952,267
- Issue date Apr 9, 2024
- Invensense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,919,769
- Issue date Mar 5, 2024
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS tab removal process
- Patent number 11,905,170
- Issue date Feb 20, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stiction reduction system and method thereof
- Patent number 11,661,332
- Issue date May 30, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 11,618,674
- Issue date Apr 4, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,542,154
- Issue date Jan 3, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modification to rough polysilicon using ion implantation and silicide
- Patent number 11,267,699
- Issue date Mar 8, 2022
- Invensense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 10,906,802
- Issue date Feb 2, 2021
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 10,745,270
- Issue date Aug 18, 2020
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20230100960
- Publication date Mar 30, 2023
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230037849
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230045257
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER
- Publication number 20220380209
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20220298009
- Publication date Sep 22, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS TAB REMOVAL PROCESS
- Publication number 20220185662
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE
- Publication number 20220144628
- Publication date May 12, 2022
- InvenSense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20220106188
- Publication date Apr 7, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER PATTERNING WITH SACRIFICIAL LAYE...
- Publication number 20210107785
- Publication date Apr 15, 2021
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE
- Publication number 20200270123
- Publication date Aug 27, 2020
- InvenSense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STICTION REDUCTION SYSTEM AND METHOD THEREOF
- Publication number 20200262697
- Publication date Aug 20, 2020
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20200131033
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20200131031
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Alan CUTHBERTSON

Person

Patents Grantslast 30 patents

Method and system for fabricating a MEMS device

Selective self-assembled monolayer patterning with sacrificial laye...

Modification to rough polysilicon using ion implantation and silicide

Sensor with dimple features and improved out-of-plane stiction

MEMS tab removal process

Actuator layer patterning with polysilicon and etch stop layer

Stiction reduction system and method thereof

Actuator layer patterning with topography

Sensor with dimple features and improved out-of-plane stiction

Modification to rough polysilicon using ion implantation and silicide

Actuator layer patterning with topography

Actuator layer patterning with topography

Patents Applicationslast 30 patents

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

MEMS TAB REMOVAL PROCESS

MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

SELECTIVE SELF-ASSEMBLED MONOLAYER PATTERNING WITH SACRIFICIAL LAYE...

MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE

STICTION REDUCTION SYSTEM AND METHOD THEREOF

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY