Alan E. Wang

Person

Hoffman Estates, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming solid blind vias through the dielectric coating o...
- Patent number 8,409,982
- Issue date Apr 2, 2013
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with improved via design
- Patent number 8,258,411
- Issue date Sep 4, 2012
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a circuit board with improved via design
- Patent number 8,141,245
- Issue date Mar 27, 2012
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of fabricating a circuit board
- Patent number 7,743,494
- Issue date Jun 29, 2010
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a printed circuit board with improved via design
- Patent number 7,690,103
- Issue date Apr 6, 2010
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacture thereof
- Patent number 7,679,001
- Issue date Mar 16, 2010
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single or multi-layer printed circuit board with improved via design
- Patent number 7,485,812
- Issue date Feb 3, 2009
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyurethane urea polishing pad
- Patent number 7,291,063
- Issue date Nov 6, 2007
- PPG Industries Ohio, Inc.
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Grant
Process for fabricating a multi layer circuit assembly
- Patent number 7,228,623
- Issue date Jun 12, 2007
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuit board
- Patent number 7,159,308
- Issue date Jan 9, 2007
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and compositions for applying multiple overlying organic pig...
- Patent number 7,157,119
- Issue date Jan 2, 2007
- PPG Industries Ohio, Inc.
- Robert H. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad
- Patent number 7,097,549
- Issue date Aug 29, 2006
- PPG Industries Ohio, Inc.
- William C. Allison
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for fabricating circuit assemblies using electrodepositable...
- Patent number 7,000,313
- Issue date Feb 21, 2006
- PPG Industries Ohio, Inc.
- Gregory J. McCollum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single or multi-layer printed circuit board with recessed or extend...
- Patent number 7,002,081
- Issue date Feb 21, 2006
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for creating vias for circuit assemblies
- Patent number 6,951,707
- Issue date Oct 4, 2005
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing pad for planarization
- Patent number 6,905,402
- Issue date Jun 14, 2005
- PPG Industries Ohio, Inc.
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Single or multi-layer printed circuit board with recessed or extend...
- Patent number 6,844,504
- Issue date Jan 18, 2005
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for creating holes in polymeric substrates
- Patent number 6,824,959
- Issue date Nov 30, 2004
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodepositable dielectric coating compositions and methods rela...
- Patent number 6,713,587
- Issue date Mar 30, 2004
- PPG Industries Ohio, Inc.
- Gregory J. McCollum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing pad
- Patent number 6,477,926
- Issue date Nov 12, 2002
- PPG Industries Ohio, Inc.
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Grant
Inkjet printing media
- Patent number 6,340,725
- Issue date Jan 22, 2002
- Hewlett-Packard Company
- Alan E. Wang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for forming a sequence of crosslinked pigmented coatings on...
- Patent number 6,214,414
- Issue date Apr 10, 2001
- PPG Industries Ohio, Inc.
- Robert H. Tang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Surfactants for incorporating silica aerogel in polyurethane foams
- Patent number 6,121,336
- Issue date Sep 19, 2000
- BASF Corporation
- Michael O. Okoroafor
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Inkjet printing media
- Patent number 6,074,761
- Issue date Jun 13, 2000
- PPG Industries Ohio, Inc.
- Alan E. Wang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Water-soluble or water-dispersible addition copolymer
- Patent number 5,998,534
- Issue date Dec 7, 1999
- PPG Industries Ohio, Inc.
- Robert H. Tang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Inkjet printing media
- Patent number 5,880,196
- Issue date Mar 9, 1999
- PPG Industries, Inc.
- Suk H. Cho
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Stable particulate dispersions
- Patent number 5,753,735
- Issue date May 19, 1998
- BASF Corporation
- Michael O. Okoroafor
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Coating composition and articles prepared therewith
- Patent number 5,744,243
- Issue date Apr 28, 1998
- PPG Industries, Inc.
- Huawen Li
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for preparing ammonium hydroxyalkyl sulfonates and ammonium...
- Patent number 5,739,365
- Issue date Apr 14, 1998
- PPG Industries, Inc.
- Robert G. Briody
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Stable particulate dispersions
- Patent number 5,691,392
- Issue date Nov 25, 1997
- PPG Industries, Inc.
- Michael O. Okoroafor
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...
- Publication number 20110266156
- Publication date Nov 3, 2011
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With Improved Via Design
- Publication number 20100012357
- Publication date Jan 21, 2010
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CO...
- Publication number 20090178838
- Publication date Jul 16, 2009
- PPG INDUSTRIES OHIO, INC.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single or Multi-Layer Printed Circuit Board With Improved Via Design
- Publication number 20090101274
- Publication date Apr 23, 2009
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Forming a Printed Circuit Board With Improved Via Design
- Publication number 20080022523
- Publication date Jan 31, 2008
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With Improved Via Design
- Publication number 20080026602
- Publication date Jan 31, 2008
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF
- Publication number 20070111561
- Publication date May 17, 2007
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITIONS WITH NONEXPANDABLE OR EXPANDED BEADS FOR CO...
- Publication number 20070087118
- Publication date Apr 19, 2007
- Robert H. Tang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyurethane Urea Polishing Pad with Window
- Publication number 20070021045
- Publication date Jan 25, 2007
- PPG INDUSTRIES OHIO, INC.
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad with window for planarization
- Publication number 20070010169
- Publication date Jan 11, 2007
- PPG INDUSTRIES OHIO, INC.
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Polyurethane urea polishing pad
- Publication number 20060254706
- Publication date Nov 16, 2006
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND COMPOSITIONS FOR APPLYING MULTIPLE OVERLYING ORGANIC PIG...
- Publication number 20060235111
- Publication date Oct 19, 2006
- ROBERT H. TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single or multi-layer printed circuit board with improved edge via...
- Publication number 20060213685
- Publication date Sep 28, 2006
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polishing pad
- Publication number 20060183412
- Publication date Aug 17, 2006
- William C. Allison
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyurethane urea polishing pad
- Publication number 20060089094
- Publication date Apr 27, 2006
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Polyurethane urea polishing pad
- Publication number 20060089095
- Publication date Apr 27, 2006
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Polyurethane urea polishing pad
- Publication number 20060089093
- Publication date Apr 27, 2006
- Robert G. Swisher
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Single or multi-layer printed circuit board with recessed or extend...
- Publication number 20060075633
- Publication date Apr 13, 2006
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method of manufacture thereof
- Publication number 20060005995
- Publication date Jan 12, 2006
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single or multi-layer printed circuit board with improved via design
- Publication number 20050124196
- Publication date Jun 9, 2005
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polishing pad having edge surface treatment
- Publication number 20050032464
- Publication date Feb 10, 2005
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Method and compositions for coating ceramic substrates
- Publication number 20050025891
- Publication date Feb 3, 2005
- Robert H. Tang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Single or multi-layer printed circuit board with recessed or extend...
- Publication number 20050006138
- Publication date Jan 13, 2005
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polishing pad with window for planarization
- Publication number 20040209066
- Publication date Oct 21, 2004
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad for planarization
- Publication number 20040102137
- Publication date May 27, 2004
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad with window for planarization
- Publication number 20040102141
- Publication date May 27, 2004
- Robert G. Swisher
- B24 - GRINDING POLISHING
Information Patent Application
Method and compositions for applying multiple overlying organic pig...
- Publication number 20040058144
- Publication date Mar 25, 2004
- Robert H. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrodepositable dielectric coating compositions and methods rela...
- Publication number 20040003999
- Publication date Jan 8, 2004
- Gregory J. McCollum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for creating holes in polymeric substrates
- Publication number 20040000426
- Publication date Jan 1, 2004
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for creating vias for circuit assemblies
- Publication number 20040000427
- Publication date Jan 1, 2004
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Alan E. Wang

Person

Patents Grantslast 30 patents

Method of forming solid blind vias through the dielectric coating o...

Printed circuit board with improved via design

Method of forming a circuit board with improved via design

Process of fabricating a circuit board

Method of forming a printed circuit board with improved via design

Circuit board and method of manufacture thereof

Single or multi-layer printed circuit board with improved via design

Polyurethane urea polishing pad

Process for fabricating a multi layer circuit assembly

Method of making a circuit board

Method and compositions for applying multiple overlying organic pig...

Polishing pad

Process for fabricating circuit assemblies using electrodepositable...

Single or multi-layer printed circuit board with recessed or extend...

Process for creating vias for circuit assemblies

Polishing pad for planarization

Single or multi-layer printed circuit board with recessed or extend...

Process for creating holes in polymeric substrates

Electrodepositable dielectric coating compositions and methods rela...

Polishing pad

Inkjet printing media

Method for forming a sequence of crosslinked pigmented coatings on...

Surfactants for incorporating silica aerogel in polyurethane foams

Inkjet printing media

Water-soluble or water-dispersible addition copolymer

Inkjet printing media

Stable particulate dispersions

Coating composition and articles prepared therewith

Method for preparing ammonium hydroxyalkyl sulfonates and ammonium...

Stable particulate dispersions

Patents Applicationslast 30 patents

METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...

Printed Circuit Board With Improved Via Design

CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CO...

Single or Multi-Layer Printed Circuit Board With Improved Via Design

Method of Forming a Printed Circuit Board With Improved Via Design

Printed Circuit Board With Improved Via Design

CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF

METHOD AND COMPOSITIONS WITH NONEXPANDABLE OR EXPANDED BEADS FOR CO...

Polyurethane Urea Polishing Pad with Window

Polishing pad with window for planarization

Polyurethane urea polishing pad

METHOD AND COMPOSITIONS FOR APPLYING MULTIPLE OVERLYING ORGANIC PIG...

Single or multi-layer printed circuit board with improved edge via...

Polishing pad

Polyurethane urea polishing pad

Polyurethane urea polishing pad

Polyurethane urea polishing pad

Single or multi-layer printed circuit board with recessed or extend...

Circuit board and method of manufacture thereof

Single or multi-layer printed circuit board with improved via design

Polishing pad having edge surface treatment

Method and compositions for coating ceramic substrates

Single or multi-layer printed circuit board with recessed or extend...

Polishing pad with window for planarization

Polishing pad for planarization

Polishing pad with window for planarization

Method and compositions for applying multiple overlying organic pig...

Electrodepositable dielectric coating compositions and methods rela...

Process for creating holes in polymeric substrates

Process for creating vias for circuit assemblies