Alan H. Woosley

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die edge reconditioning
- Patent number 7,374,971
- Issue date May 20, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor with coated leads and method therefore
- Patent number 7,105,383
- Issue date Sep 12, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Nhat D. Vo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged integrated circuit having wire bonds and method therefor
- Patent number 7,015,585
- Issue date Mar 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device including bond wires
- Patent number 6,998,952
- Issue date Feb 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contoured package body profile
- Patent number 5,708,300
- Issue date Jan 13, 1998
- Alan H. Woosley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor device
- Patent number 5,656,549
- Issue date Aug 12, 1997
- Motorola, Inc.
- Alan H. Woosley
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded carrier ring leadframe having a particular resin injecting a...
- Patent number 5,517,056
- Issue date May 14, 1996
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating semiconductor devices with package bodies
- Patent number 5,344,600
- Issue date Sep 6, 1994
- Motorola, Inc.
- Michael B. McShane
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device having window-frame flag with tapered edge in...
- Patent number 5,233,222
- Issue date Aug 3, 1993
- Motorola, Inc.
- Frank Djennas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor die edge reconditioning
- Publication number 20060237850
- Publication date Oct 26, 2006
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive device including bond wires
- Publication number 20050122198
- Publication date Jun 9, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit having wire bonds and method therefor
- Publication number 20040119168
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor with coated leads and method therefore
- Publication number 20040041241
- Publication date Mar 4, 2004
- Nhat D. Vo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Alan H. Woosley

Person

Patents Grantslast 30 patents

Semiconductor die edge reconditioning

Packaged semiconductor with coated leads and method therefore

Packaged integrated circuit having wire bonds and method therefor

Inductive device including bond wires

Semiconductor device having contoured package body profile

Method of packaging a semiconductor device

Molded carrier ring leadframe having a particular resin injecting a...

Method for encapsulating semiconductor devices with package bodies

Semiconductor device having window-frame flag with tapered edge in...

Patents Applicationslast 30 patents

Semiconductor die edge reconditioning

Inductive device including bond wires

Packaged integrated circuit having wire bonds and method therefor

Packaged semiconductor with coated leads and method therefore