Alan J. Magnus

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Using a backside mask layer for forming a unique die mark identifie...
- Patent number 11,450,616
- Issue date Sep 20, 2022
- NXP USA, INC.
- David Robert Currier
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for increasing semiconductor device wafer strength
- Patent number 10,998,231
- Issue date May 4, 2021
- NXP USA, INC.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an electronic component package
- Patent number 10,340,251
- Issue date Jul 2, 2019
- NXP USA, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized redistribution layer structure for embedded component pac...
- Patent number 10,056,360
- Issue date Aug 21, 2018
- NXP USA, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically-masked microelectronic packages and methods for the fabri...
- Patent number 9,997,492
- Issue date Jun 12, 2018
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized redistribution layer structure for embedded component pac...
- Patent number 9,691,743
- Issue date Jun 27, 2017
- NXP USA, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages and methods for producing wafer level packages...
- Patent number 9,502,363
- Issue date Nov 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shielding MEMS structures during front side wafer dicing
- Patent number 9,458,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,455,216
- Issue date Sep 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level packages having non-wettable solder collars and methods...
- Patent number 9,401,339
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices with embedded die interconnect structures, and m...
- Patent number 9,401,338
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding MEMS structures during wafer dicing
- Patent number 9,346,671
- Issue date May 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having texturized solder pads and methods...
- Patent number 9,281,286
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having layered interconnect structures and...
- Patent number 9,281,293
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,093,436
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wettable lead ends on a flat-pack no-lead microelectronic package
- Patent number 9,070,669
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages including patterned die attach material an...
- Patent number 8,962,389
- Issue date Feb 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- William C. Stermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 8,841,758
- Issue date Sep 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Redistributed chip packages containing multiple components and meth...
- Patent number 8,822,268
- Issue date Sep 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having backside contact and method for...
- Patent number 8,685,790
- Issue date Apr 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical coupling of wafer structures
- Patent number 8,138,062
- Issue date Mar 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methodology for processing a panel during semiconductor device fabr...
- Patent number 7,892,950
- Issue date Feb 22, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly and method for forming
- Patent number 7,132,303
- Issue date Nov 7, 2006
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact
- Patent number 6,248,664
- Issue date Jun 19, 2001
- Semiconductor Components Industries LLC
- Naresh C. Saha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Die Traceability Using Backside Mask Layers
- Publication number 20220037264
- Publication date Feb 3, 2022
- NXP USA, Inc.
- David Robert Currier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH
- Publication number 20200395247
- Publication date Dec 17, 2020
- NXP USA, Inc.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC COMPONENT PACKAGE
- Publication number 20180315734
- Publication date Nov 1, 2018
- NXP USA, Inc.
- Alan J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED REDISTRIBUTION LAYER STRUCTURE FOR EMBEDDED COMPONENT PAC...
- Publication number 20170256525
- Publication date Sep 7, 2017
- NXP USA, Inc.
- ALAN J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED REDISTRIBUTION LAYER STRUCTURE FOR EMBEDDED COMPONENT PAC...
- Publication number 20170084591
- Publication date Mar 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS...
- Publication number 20160064341
- Publication date Mar 3, 2016
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACAKGES HAVING NON-WETTABLE SOLDER COLLARS AND METHODS...
- Publication number 20150333028
- Publication date Nov 19, 2015
- WENG F. YAP
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...
- Publication number 20150270233
- Publication date Sep 24, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING
- Publication number 20150232332
- Publication date Aug 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20150228560
- Publication date Aug 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING MEMS STRUCTURES DURING WAFER DICING
- Publication number 20150217998
- Publication date Aug 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICALLY-MASKED MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRI...
- Publication number 20150137381
- Publication date May 21, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...
- Publication number 20150115454
- Publication date Apr 30, 2015
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AN...
- Publication number 20140353772
- Publication date Dec 4, 2014
- William C. Stermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140338956
- Publication date Nov 20, 2014
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
- Publication number 20140167247
- Publication date Jun 19, 2014
- FREESCALE SEMICONDUCTOR IN.
- ALAN J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND M...
- Publication number 20140145325
- Publication date May 29, 2014
- ALAN J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTABLE LEAD ENDS ON A FLAT-PACK NO-LEAD MICROELECTRONIC PACKAGE
- Publication number 20140134799
- Publication date May 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140001616
- Publication date Jan 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
- Publication number 20130207255
- Publication date Aug 15, 2013
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COUPLING OF WAFER STRUCTURES
- Publication number 20110143476
- Publication date Jun 16, 2011
- LIANJUN LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODOLOGY FOR PROCESSING A PANEL DURING SEMICONDUCTOR DEVICE FABR...
- Publication number 20100279467
- Publication date Nov 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device assembly and method for forming
- Publication number 20050136558
- Publication date Jun 23, 2005
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Alan J. Magnus

Person

Patents Grantslast 30 patents

Using a backside mask layer for forming a unique die mark identifie...

Method for increasing semiconductor device wafer strength

Method for making an electronic component package

Localized redistribution layer structure for embedded component pac...

Optically-masked microelectronic packages and methods for the fabri...

Localized redistribution layer structure for embedded component pac...

Wafer level packages and methods for producing wafer level packages...

Method for shielding MEMS structures during front side wafer dicing

Semiconductor device package and method of manufacture

Wafer level packages having non-wettable solder collars and methods...

Electronic devices with embedded die interconnect structures, and m...

Shielding MEMS structures during wafer dicing

Microelectronic packages having texturized solder pads and methods...

Microelectronic packages having layered interconnect structures and...

Semiconductor device package and method of manufacture

Wettable lead ends on a flat-pack no-lead microelectronic package

Microelectronic packages including patterned die attach material an...

Semiconductor device package and method of manufacture

Redistributed chip packages containing multiple components and meth...

Semiconductor device package having backside contact and method for...

Electrical coupling of wafer structures

Methodology for processing a panel during semiconductor device fabr...

Stacked semiconductor device assembly and method for forming

Method of forming a contact

Patents Applicationslast 30 patents

Die Traceability Using Backside Mask Layers

METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH

METHOD FOR MAKING AN ELECTRONIC COMPONENT PACKAGE

LOCALIZED REDISTRIBUTION LAYER STRUCTURE FOR EMBEDDED COMPONENT PAC...

LOCALIZED REDISTRIBUTION LAYER STRUCTURE FOR EMBEDDED COMPONENT PAC...

MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS...

WAFER LEVEL PACAKGES HAVING NON-WETTABLE SOLDER COLLARS AND METHODS...

WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...

METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SHIELDING MEMS STRUCTURES DURING WAFER DICING

OPTICALLY-MASKED MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRI...

MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...

MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AN...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...

ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND M...

WETTABLE LEAD ENDS ON A FLAT-PACK NO-LEAD MICROELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...

ELECTRICAL COUPLING OF WAFER STRUCTURES

METHODOLOGY FOR PROCESSING A PANEL DURING SEMICONDUCTOR DEVICE FABR...

Stacked semiconductor device assembly and method for forming