Alan James Emerick

Person

Warren Center, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density integrated circuit packaging with chip stacking and vi...
- Patent number 6,236,115
- Issue date May 22, 2001
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit packaging with chip stacking and vi...
- Patent number 6,187,678
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit packaging with chip stacking and vi...
- Patent number 6,002,177
- Issue date Dec 14, 1999
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an electronic circuit package
- Patent number 5,567,984
- Issue date Oct 22, 1996
- International Business Machines Corporation
- Jerzy M. Zalesinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate soldering in a reducing atmosphere
- Patent number 5,145,104
- Issue date Sep 8, 1992
- International Business Machines Corporation
- Joseph A. Apap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Affixing pluggable pins to a ceramic substrate
- Patent number 5,050,296
- Issue date Sep 24, 1991
- International Business Machines Corporation
- Alan J. Emerick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste for use in a reducing atmosphere
- Patent number 4,919,729
- Issue date Apr 24, 1990
- International Business Machines Corporation
- Peter J. Elmgren
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder leveling method and apparatus
- Patent number 4,869,418
- Issue date Sep 26, 1989
- International Business Machines Corporation
- John P. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder leveling method and apparatus
- Patent number 4,799,616
- Issue date Jan 24, 1989
- International Business Machines Corporation
- John P. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder leveling technique
- Patent number 4,676,426
- Issue date Jun 30, 1987
- IBM Corp.
- Russell E. Darrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Alan James Emerick

Person

Patents Grantslast 30 patents

High density integrated circuit packaging with chip stacking and vi...

High density integrated circuit packaging with chip stacking and vi...

High density integrated circuit packaging with chip stacking and vi...

Process for fabricating an electronic circuit package

Substrate soldering in a reducing atmosphere

Affixing pluggable pins to a ceramic substrate

Solder paste for use in a reducing atmosphere

Solder leveling method and apparatus

Solder leveling method and apparatus

Solder leveling technique