Alan Martin

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Discrete capacitor structure
- Patent number 10,931,192
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Alan Dean Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens wafer assembly and associated method for manufacturing a stepp...
- Patent number 10,677,964
- Issue date Jun 9, 2020
- OmniVision Technologies, Inc.
- Alan Martin
- G02 - OPTICS
Information Patent Grant
Concave spacer-wafer apertures and wafer-level optical elements for...
- Patent number 9,798,114
- Issue date Oct 24, 2017
- OmniVision Technologies, Inc.
- Edward Nabighian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer-level bonding method for camera fabrication
- Patent number 9,553,126
- Issue date Jan 24, 2017
- OmniVision Technologies, Inc.
- Alan Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for black coating of camera cubes at wafer level
- Patent number 9,293,505
- Issue date Mar 22, 2016
- OmniVision Technologies, Inc.
- Edward Nabighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverting buck-boost using single-inductor boost and charge pump wi...
- Patent number 8,947,057
- Issue date Feb 3, 2015
- Texas Instruments Incorporated
- Alan Dean Martin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Suppressing power bus bouncing in a hot-swappable system
- Patent number 6,447,309
- Issue date Sep 10, 2002
- Sun Microsystems, Inc.
- Han Y. Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LENS WAFER ASSEMBLY AND ASSOCIATED METHOD FOR MANUFACTURING A STEPP...
- Publication number 20190121003
- Publication date Apr 25, 2019
- OMNIVISION TECHNOLOGIES, INC.
- Alan Martin
- G02 - OPTICS
Information Patent Application
DISCRETE CAPACITOR STRUCTURE
- Publication number 20180076707
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Alan Dean Martin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONCAVE SPACER-WAFER APERTURES AND WAFER-LEVEL OPTICAL ELEMENTS FOR...
- Publication number 20150362705
- Publication date Dec 17, 2015
- OMNIVISION TECHNOLOGIES, INC.
- Edward NABIGHIAN
- G02 - OPTICS
Information Patent Application
Wafer-Level Bonding Method For Camera Fabrication
- Publication number 20150318326
- Publication date Nov 5, 2015
- OMNIVISION TECHNOLOGIES, INC.
- Alan Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System And Method For Black Coating Of Camera Cubes At Wafer Level
- Publication number 20150318325
- Publication date Nov 5, 2015
- OMNIVISION TECHNOLOGIES, INC.
- Edward Nabighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inverting Buck-Boost Using Single-Inductor Boost and Charge Pump wi...
- Publication number 20140002046
- Publication date Jan 2, 2014
- Alan Dean Martin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Suppressing power bus bouncing in a hot swappable system
- Publication number 20020072259
- Publication date Jun 13, 2002
- Han Y. Ko
- H01 - BASIC ELECTRIC ELEMENTS

Alan Martin

Person

Patents Grantslast 30 patents

Discrete capacitor structure

Lens wafer assembly and associated method for manufacturing a stepp...

Concave spacer-wafer apertures and wafer-level optical elements for...

Wafer-level bonding method for camera fabrication

System and method for black coating of camera cubes at wafer level

Inverting buck-boost using single-inductor boost and charge pump wi...

Suppressing power bus bouncing in a hot-swappable system

Patents Applicationslast 30 patents

LENS WAFER ASSEMBLY AND ASSOCIATED METHOD FOR MANUFACTURING A STEPP...

DISCRETE CAPACITOR STRUCTURE

CONCAVE SPACER-WAFER APERTURES AND WAFER-LEVEL OPTICAL ELEMENTS FOR...

Wafer-Level Bonding Method For Camera Fabrication

System And Method For Black Coating Of Camera Cubes At Wafer Level

Inverting Buck-Boost Using Single-Inductor Boost and Charge Pump wi...

Suppressing power bus bouncing in a hot swappable system