Alan McAllister

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder contacts for socket assemblies
- Patent number 10,321,573
- Issue date Jun 11, 2019
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder contacts for socket assemblies
- Patent number 9,860,988
- Issue date Jan 2, 2018
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a chip assembly in a socket housing
- Patent number 8,904,630
- Issue date Dec 9, 2014
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sliding package retention device for LGA sockets
- Patent number 8,151,450
- Issue date Apr 10, 2012
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20180192519
- Publication date Jul 5, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20160338199
- Publication date Nov 17, 2016
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
- Publication number 20120151762
- Publication date Jun 21, 2012
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
- Publication number 20100162561
- Publication date Jul 1, 2010
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR