Albert Douglas

Person

Yorba Linda, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertically stacked pre-packaged integrated circuit chips
- Patent number 8,012,803
- Issue date Sep 6, 2011
- Aprolase Development Co., LLC
- Keith Gann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vertically stacked pre-packaged integrated circuit chips
- Patent number 7,872,339
- Issue date Jan 18, 2011
- Keith Gann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stackable semiconductor chip layer comprising prefabricated trench...
- Patent number 7,786,562
- Issue date Aug 31, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical interconnection of angularly disposed conduct...
- Patent number 6,993,835
- Issue date Feb 7, 2006
- Irvine Sensors Corp.
- Douglas Marice Albert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for connecting vertically stacked integrated c...
- Patent number 6,806,559
- Issue date Oct 19, 2004
- Irvine Sensors Corporation
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Patent number 6,706,971
- Issue date Mar 16, 2004
- Irvine Sensors Corporation
- Douglas M. Albert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS
- Publication number 20110045635
- Publication date Feb 24, 2011
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...
- Publication number 20100291735
- Publication date Nov 18, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cornerbond assembly comprising three-dimensional electronic modules
- Publication number 20060126307
- Publication date Jun 15, 2006
- Albert Douglas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable semiconductor chip layer comprising prefabricated trench...
- Publication number 20050277288
- Publication date Dec 15, 2005
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for electrical interconnection of angularly disposed conduct...
- Publication number 20050121227
- Publication date Jun 9, 2005
- Douglas Marice Albert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertically stacked pre-packaged integrated circuit chips
- Publication number 20050077621
- Publication date Apr 14, 2005
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked microelectronic module with vertical interconnect vias
- Publication number 20040113222
- Publication date Jun 17, 2004
- Volkan H. Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for connecting vertically stacked integrated c...
- Publication number 20030197253
- Publication date Oct 23, 2003
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Publication number 20020126459
- Publication date Sep 12, 2002
- Douglas M. Albert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Publication number 20020100600
- Publication date Aug 1, 2002
- Douglas M. Albert
- H01 - BASIC ELECTRIC ELEMENTS

Albert Douglas

Person

Patents Grantslast 30 patents

Vertically stacked pre-packaged integrated circuit chips

Vertically stacked pre-packaged integrated circuit chips

Stackable semiconductor chip layer comprising prefabricated trench...

Method for electrical interconnection of angularly disposed conduct...

Method and apparatus for connecting vertically stacked integrated c...

Stackable microcircuit layer formed from a plastic encapsulated mic...

Patents Applicationslast 30 patents

VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...

Cornerbond assembly comprising three-dimensional electronic modules

Stackable semiconductor chip layer comprising prefabricated trench...

Method for electrical interconnection of angularly disposed conduct...

Vertically stacked pre-packaged integrated circuit chips

Stacked microelectronic module with vertical interconnect vias

Method and apparatus for connecting vertically stacked integrated c...

Stackable microcircuit layer formed from a plastic encapsulated mic...

Stackable microcircuit layer formed from a plastic encapsulated mic...