Albert Lin

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Flip clip bonding leadframe-type packaging method for integrated ci...
- Patent number 6,258,622
- Issue date Jul 10, 2001
- Apack Technologies Inc.
- Albert Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving the reliability of underfill process for a chip
- Patent number 6,221,689
- Issue date Apr 24, 2001
- Apack Technologies Inc.
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printer driving method for supporting asymmetric graphic resolution
- Publication number 20050206924
- Publication date Sep 22, 2005
- Albert Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE