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Albert LOH
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Fremont, CA, US
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last 30 patents
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Patent Grant
Semiconductor package with multiple stacked leadframes and a method...
Patent number
10,361,146
Issue date
Jul 23, 2019
UTAC HEADQUARTERS PTE, LTD.
Saravuth Sirinorakul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with multiple stacked leadframes and a method...
Patent number
10,276,477
Issue date
Apr 30, 2019
UTAC HEADQUARTERS PTE. LTD.
Saravuth Sirinorakul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal leadless array package with die attach pad locking feature
Patent number
9,196,504
Issue date
Nov 24, 2015
UTAC DONGGUAN LTD.
Albert Loh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE STACKED LEADFRAMES AND A METHOD...
Publication number
20190181077
Publication date
Jun 13, 2019
UTAC Headquarters Pte. Ltd.
Saravuth Sirinorakul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE
Publication number
20140008777
Publication date
Jan 9, 2014
UTAC DONGGUAN LTD
Albert LOH
H01 - BASIC ELECTRIC ELEMENTS