Albert S. Lopez

Follow

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
TSV-less die stacking using plated pillars/through mold interconnect
- Patent number 11,296,052
- Issue date Apr 5, 2022
- Intel Corporation
- Preston T. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaging for a wearable electronic device
- Patent number 10,820,437
- Issue date Oct 27, 2020
- Intel Corporation
- Aleksandar Aleksov
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199453
- Publication date Jun 23, 2022
- Intel Corporation
- Michael J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-LESS DIE STACKING USING PLATED PILLARS/THROUGH MOLD INTERCONNECT
- Publication number 20200212012
- Publication date Jul 2, 2020
- Intel Corporation
- Preston T. MEYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGING FOR A WEARABLE ELECTRONIC DEVICE
- Publication number 20190281717
- Publication date Sep 12, 2019
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR