Albert Wan

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having antenna and manufacturing method thereof
- Patent number 12,057,415
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 11,855,333
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having antenna on chip package and manufacturi...
- Patent number 11,705,409
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 11,515,618
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,335,655
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,282,810
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 10,978,782
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating package structure
- Patent number 10,879,197
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,872,842
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method for packagin...
- Patent number 10,867,882
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,867,940
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,756,052
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having antenna and manufacturing method thereof
- Patent number 10,741,508
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 10,636,713
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of semiconductor device with antenna and heat spreader
- Patent number 10,490,479
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,475,757
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having connecting module
- Patent number 10,381,309
- Issue date Aug 13, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,366,966
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,186,492
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,183,858
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Albert Wan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device structure
- Patent number 10,157,859
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages and manufacturing mehtods thereof
- Patent number 10,157,807
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 9,875,972
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20240128635
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF
- Publication number 20230307391
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20220368005
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20210257717
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210098396
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200335477
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF
- Publication number 20200335459
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273773
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20200258799
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGIN...
- Publication number 20200091031
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200058607
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE
- Publication number 20190355694
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190333877
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190157224
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20190157206
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20190115271
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20190067220
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190027449
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180148317
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- ALBERT WAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20180130756
- Publication date May 10, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shou-Zen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180019209
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shou-Zen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20170345731
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor packages and manufacturing methods thereof

Semiconductor device having antenna and manufacturing method thereof

Semiconductor packages and manufacturing methods thereof

Semiconductor device having antenna on chip package and manufacturi...

Semiconductor packages and manufacturing methods thereof

Package structure and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor packages and manufacturing methods thereof

Package structure and method of fabricating package structure

Semiconductor device and manufacturing method thereof

Semiconductor package, semiconductor device and method for packagin...

Package structure and manufacturing method thereof

Method of manufacturing integrated fan-out package

Semiconductor device having antenna and manufacturing method thereof

Semiconductor packages and manufacturing methods thereof

Packaging of semiconductor device with antenna and heat spreader

Package structure and manufacturing method thereof

Package structure having connecting module

Method of manufacturing integrated fan-out package

Package structure and manufacturing method thereof

Semiconductor structure and method of manufacturing the same

Semiconductor device structure

Sensor packages and manufacturing mehtods thereof

Semiconductor device structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGIN...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURES

SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SENSOR PACKAGES AND MANUFACTURING MEHTODS THEREOF