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Alberto Jose TEIXEIRA DE QUEIROS
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Munich, DE
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last 30 patents
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Patent Grant
Package comprising a substrate, an integrated device, and an encaps...
Patent number
11,605,571
Issue date
Mar 14, 2023
QUALCOMM Incorporated
Alberto Jose Teixeira De Queiros
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
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Patent Application
HIGH-POWER DIE HEAT SINK WITH VERTICAL HEAT PATH
Publication number
20220359338
Publication date
Nov 10, 2022
QUALCOMM TECHNOLOGIES, INC.
Jose MOREIRA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAP...
Publication number
20210375707
Publication date
Dec 2, 2021
QUALCOMM Incorporated
Alberto Jose TEIXEIRA DE QUEIROS
H01 - BASIC ELECTRIC ELEMENTS