Alec Dorfner

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Fort Ann, NY, US

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Patents Applicationslast 30 patents

Information Patent Application
TUNGSTEN-BASED ADDITIVE FOR THROUGH-SUBSTRATE ETCHING
- Publication number 20250239457
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Scott Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER BY LAYER ETCH PROCESS
- Publication number 20250191929
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240347346
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Minjoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES USING METAL HARDMASKS
- Publication number 20240079246
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Hardmasks
- Publication number 20230397416
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS