Alex Elliott

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method
- Patent number 9,799,627
- Issue date Oct 24, 2017
- Semiconductor Components Industries, LLC
- Bishnu Prasanna Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange package for a semiconductor device
- Patent number 8,618,650
- Issue date Dec 31, 2013
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange package for a semiconductor device
- Patent number 8,338,937
- Issue date Dec 25, 2012
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink moldlocks
- Patent number 8,310,042
- Issue date Nov 13, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Alexander J. Elliott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of packaging a semiconductor die and package thereof
- Patent number 7,445,967
- Issue date Nov 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thin GaAs die with copper-back metal struc...
- Patent number 7,092,890
- Issue date Aug 15, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature moldlocks for heatsink or flag for an overmolded plastic...
- Patent number 7,091,602
- Issue date Aug 15, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a mount for electronic devices
- Patent number 6,996,897
- Issue date Feb 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Frank J. Mosna, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High impedance radio frequency power plastic package
- Patent number 6,982,483
- Issue date Jan 3, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin GaAs die with copper back-metal structure
- Patent number 6,870,243
- Issue date Mar 22, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Alexander James Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,147,410
- Issue date Nov 14, 2000
- Motorola, Inc.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe structure having moveable sub-frame
- Patent number 5,920,113
- Issue date Jul 6, 1999
- Motorola, Inc.
- Hin Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method
- Patent number 5,786,745
- Issue date Jul 28, 1998
- Motorola, Inc.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor chip package
- Patent number 5,690,877
- Issue date Nov 25, 1997
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an optoelectronic device
- Patent number 5,614,131
- Issue date Mar 25, 1997
- Motorola, Inc.
- Prosanto K. Mukerji
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold assembly with separate encapsulating cavities
- Patent number 5,175,007
- Issue date Dec 29, 1992
- Motorola, Inc.
- Alexander J. Elliott
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of removing contaminants from a plated article with a clean...
- Patent number 5,075,255
- Issue date Dec 24, 1991
- Motorola, Inc.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roll forming of semiconductor component leadframes
- Patent number 5,074,139
- Issue date Dec 24, 1991
- Motorola, Inc.
- Alexander J. Elliott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD
- Publication number 20140035114
- Publication date Feb 6, 2014
- Semiconductor Components Industries, LLC
- Bishnu Prasanna Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20130087894
- Publication date Apr 11, 2013
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flange Package For A Semiconductor Device
- Publication number 20100032825
- Publication date Feb 11, 2010
- HVVI SEMICONDUCTORS, INC.
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DIE
- Publication number 20090023248
- Publication date Jan 22, 2009
- Freescale Semiconductor, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging a semiconductor die and package thereof
- Publication number 20070172990
- Publication date Jul 26, 2007
- Freescale Semiconductor, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK MOLDLOCKS
- Publication number 20060220187
- Publication date Oct 5, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing thin gaas die with copper-back metal struc...
- Publication number 20050127480
- Publication date Jun 16, 2005
- Freescale Semiconductor, Inc.
- Alexander James Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High impedance radio frequency power plastic package
- Publication number 20040241913
- Publication date Dec 2, 2004
- MOTOROLA, INC.
- Robert J. Mclaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Miniature moldlocks for heatsink or flag for an overmolded plastic...
- Publication number 20040113262
- Publication date Jun 17, 2004
- MOTOROLA, INC.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin GaAs die with copper back-metal structure
- Publication number 20040099932
- Publication date May 27, 2004
- MOTOROLA, INC.
- Alexander James Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting surfaces for electronic devices
- Publication number 20040022016
- Publication date Feb 5, 2004
- Frank J. Mosna
- H01 - BASIC ELECTRIC ELEMENTS

Alex Elliott

Person

Patents Grantslast 30 patents

Semiconductor package structure and method

Flange package for a semiconductor device

Flange package for a semiconductor device

Heatsink moldlocks

Method of packaging a semiconductor die and package thereof

Method for manufacturing thin GaAs die with copper-back metal struc...

Miniature moldlocks for heatsink or flag for an overmolded plastic...

Method of making a mount for electronic devices

High impedance radio frequency power plastic package

Thin GaAs die with copper back-metal structure

Electronic component and method of manufacture

Leadframe structure having moveable sub-frame

Electronic package and method

Method of processing a semiconductor chip package

Method of making an optoelectronic device

Mold assembly with separate encapsulating cavities

Method of removing contaminants from a plated article with a clean...

Roll forming of semiconductor component leadframes

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD

FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE

Flange Package For A Semiconductor Device

METHOD OF PACKAGING A SEMICONDUCTOR DIE

Method of packaging a semiconductor die and package thereof

HEATSINK MOLDLOCKS

Method for manufacturing thin gaas die with copper-back metal struc...

High impedance radio frequency power plastic package

Miniature moldlocks for heatsink or flag for an overmolded plastic...

Thin GaAs die with copper back-metal structure

Mounting surfaces for electronic devices