Alex Fahn

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Jubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of making tall flip chip bumps
- Patent number 6,756,184
- Issue date Jun 29, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chiou-Shian Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing solder bodies from a semiconductor wafer
- Patent number 6,319,846
- Issue date Nov 20, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of making tall flip chip bumps
- Publication number 20030073036
- Publication date Apr 17, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chiou-Shian Peng
- H01 - BASIC ELECTRIC ELEMENTS