Alex Gritti

Person

Vimercate, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with wettable slot structures
- Patent number 11,309,237
- Issue date Apr 19, 2022
- STMicroelectronics S.r.l.
- Marco Del Sarto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-transducer modulus, electronic apparatus including the multi-...
- Patent number 10,605,684
- Issue date Mar 31, 2020
- STMicroelectronics S.r.l.
- Alex Gritti
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectromechanical microphone
- Patent number 10,225,635
- Issue date Mar 5, 2019
- STMicroelectronics S.r.l.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a lid for an electronic device package, a...
- Patent number 9,822,001
- Issue date Nov 21, 2017
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shielded encapsulating structure and manufacturing method thereof
- Patent number 9,428,380
- Issue date Aug 30, 2016
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shielded encapsulating structure and manufacturing method thereof
- Patent number 9,060,227
- Issue date Jun 16, 2015
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical transducer and corresponding assembly process
- Patent number 8,837,754
- Issue date Sep 16, 2014
- STMicroelectronics S.r.l.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die semiconductor package
- Patent number 7,605,476
- Issue date Oct 20, 2009
- STMicroelectronics S.r.l.
- Alex Gritti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE CARRYING A PLURALITY OF ELECTRONIC DEVICES
- Publication number 20230171911
- Publication date Jun 1, 2023
- STMicroelectronics S.r.l.
- Luca MAGGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GAL...
- Publication number 20220238485
- Publication date Jul 28, 2022
- STMicroelectronics S.r.l.
- Dario PACI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM...
- Publication number 20220099957
- Publication date Mar 31, 2022
- STMicroelectronics S.r.l.
- Marco DEL SARTO
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE AND CORRESPONDING METHOD
- Publication number 20220033251
- Publication date Feb 3, 2022
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE SLOT STRUCTURES
- Publication number 20210098355
- Publication date Apr 1, 2021
- STMicroelectronics S.r.l.
- Marco DEL SARTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TRANSDUCER MODULUS, ELECTRONIC APPARATUS INCLUDING THE MULTI-...
- Publication number 20180149538
- Publication date May 31, 2018
- STMicroelectronics S.r.l.
- Alex GRITTI
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE
- Publication number 20170006368
- Publication date Jan 5, 2017
- STMicroelectronics S.r.l.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150217993
- Publication date Aug 6, 2015
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A LID FOR AN ELECTRONIC DEVICE PACKAGE, A...
- Publication number 20140131819
- Publication date May 15, 2014
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130105952
- Publication date May 2, 2013
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS
- Publication number 20120153771
- Publication date Jun 21, 2012
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked die semiconductor package
- Publication number 20070069391
- Publication date Mar 29, 2007
- STMicroelectronics S.r. I.
- Alex Gritti
- H01 - BASIC ELECTRIC ELEMENTS

Alex Gritti

Person

Patents Grantslast 30 patents

Electronic device and corresponding method

Semiconductor package with wettable slot structures

Multi-transducer modulus, electronic apparatus including the multi-...

Microelectromechanical microphone

Process for manufacturing a lid for an electronic device package, a...

Shielded encapsulating structure and manufacturing method thereof

Shielded encapsulating structure and manufacturing method thereof

Microelectromechanical transducer and corresponding assembly process

Stacked die semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC MODULE CARRYING A PLURALITY OF ELECTRONIC DEVICES

PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GAL...

INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM...

ELECTRONIC DEVICE AND CORRESPONDING METHOD

SEMICONDUCTOR PACKAGE WITH WETTABLE SLOT STRUCTURES

MULTI-TRANSDUCER MODULUS, ELECTRONIC APPARATUS INCLUDING THE MULTI-...

MICROELECTROMECHANICAL MICROPHONE

SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF

PROCESS FOR MANUFACTURING A LID FOR AN ELECTRONIC DEVICE PACKAGE, A...

SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS

Stacked die semiconductor package