Alex Hsu

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for reducing crosstalk in image sensors using implant techno...
- Patent number 8,440,495
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize substrate thickness for image sensor device
- Patent number 8,405,177
- Issue date Mar 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of measurement in semiconductor fabrication
- Patent number 8,178,422
- Issue date May 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Hsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of wafer bonding
- Patent number 8,173,518
- Issue date May 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Martin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize substrate thickness for image sensor device
- Patent number 8,030,721
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize substrate thickness for image sensor device
- Patent number 7,838,325
- Issue date Nov 23, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO OPTIMIZE SUBSTRATE THICKNESS FOR IMAGE SENSOR DEVICE
- Publication number 20120007204
- Publication date Jan 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO OPTIMIZE SUBSTRATE THICKNESS FOR IMAGE SENSOR DEVICE
- Publication number 20110031542
- Publication date Feb 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASUREMENT IN SEMICONDUCTOR FABRICATION
- Publication number 20100244287
- Publication date Sep 30, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Hsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF WAFER BONDING
- Publication number 20100248414
- Publication date Sep 30, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Martin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO OPTIMIZE SUBSTRATE THICKNESS FOR IMAGE SENSOR DEVICE
- Publication number 20100207230
- Publication date Aug 19, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Reducing Crosstalk In Image Sensors Using Implant Techno...
- Publication number 20080217719
- Publication date Sep 11, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- J. C. Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for reducing crosstalk in image sensors using implant techno...

Method to optimize substrate thickness for image sensor device

Method of measurement in semiconductor fabrication

Method of wafer bonding

Method to optimize substrate thickness for image sensor device

Method to optimize substrate thickness for image sensor device

Patents Applicationslast 30 patents

METHOD TO OPTIMIZE SUBSTRATE THICKNESS FOR IMAGE SENSOR DEVICE

METHOD TO OPTIMIZE SUBSTRATE THICKNESS FOR IMAGE SENSOR DEVICE

METHOD OF MEASUREMENT IN SEMICONDUCTOR FABRICATION

METHOD OF WAFER BONDING

METHOD TO OPTIMIZE SUBSTRATE THICKNESS FOR IMAGE SENSOR DEVICE

Method For Reducing Crosstalk In Image Sensors Using Implant Techno...