Alex Kungo

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 10,741,507
- Issue date Aug 11, 2020
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...
- Publication number 20200365530
- Publication date Nov 19, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...
- Publication number 20180233463
- Publication date Aug 16, 2018
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS