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Alex L. Chan

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  • Nepean, CA
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PLATED VIA-IN-VIA VERTICAL CONNECTION
    • Publication number 20250031318
    • Publication date Jan 23, 2025
    • Nokia Solutions and Networks Oy
    • Paul BROWN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRE-ASSEMBLY WARPAGE PAIRING
    • Publication number 20240381603
    • Publication date Nov 14, 2024
    • Nokia Solutions and Networks Oy
    • Paul Brown
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CONFIGURABLE WARPAGE CONTROL SPACERS
    • Publication number 20240347432
    • Publication date Oct 17, 2024
    • Nokia Solutions and Networks Oy
    • Alex Chan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SACRIFICIAL SOLDER LAYER FOR BROACHING CLINCH NUT ASSEMBLY
    • Publication number 20240292546
    • Publication date Aug 29, 2024
    • Nokia Solutions and Networks Oy
    • Daniel Fazari
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOARD EDGE ELECTRICAL CONTACT STRUCTURES
    • Publication number 20230232533
    • Publication date Jul 20, 2023
    • Nokia Solutions and Networks Oy
    • David NORTH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER TRENCH
    • Publication number 20230132123
    • Publication date Apr 27, 2023
    • Paul Brown
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISCRETE COMPONENT CARRIER
    • Publication number 20200170116
    • Publication date May 28, 2020
    • Nokia Solutions and Networks Oy
    • Alex CHAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SPATIAL LOCATION OF VIAS IN A PRINTED CIRCUIT BOARD
    • Publication number 20190087524
    • Publication date Mar 21, 2019
    • Nokia Solutions and Networks Oy
    • Paul J. BROWN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID
    • Publication number 20180242447
    • Publication date Aug 23, 2018
    • ALCATEL-LUCENT CANADA INC.
    • James M. SCHRIEL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    NON-ORTHOGONAL ROUTING ON A PRINTED CIRCUIT BOARD
    • Publication number 20180165401
    • Publication date Jun 14, 2018
    • Alcatel-Lucent Canada, Inc.
    • Paul J. BROWN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SIDE CLAMPING BGA SOCKET
    • Publication number 20180098447
    • Publication date Apr 5, 2018
    • Alcatel-Lucent Canada Inc.
    • Paul J. BROWN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY
    • Publication number 20180082868
    • Publication date Mar 22, 2018
    • Alcatel-Lucent Canada Inc.
    • Paul J. BROWN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    UNDERLYING RECESSED COMPONENT PLACEMENT
    • Publication number 20180020547
    • Publication date Jan 18, 2018
    • ALCATEL-LUCENT CANADA INC.
    • Alex L. CHAN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID
    • Publication number 20170367180
    • Publication date Dec 21, 2017
    • Alcatel-Lucent Canada, Inc.
    • James M. SCHRIEL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY
    • Publication number 20170280569
    • Publication date Sep 28, 2017
    • Alcatel-Lucent Canada, Inc.
    • James M. SCHRIEL
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    RELIEVED COMPONENT PAD FOR 0201 USE BETWEEN VIAS
    • Publication number 20170142831
    • Publication date May 18, 2017
    • Alcatel-Lucent Canada, Inc.
    • Alex L. Chan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BACKDRILL RELIABILITY ANCHORS
    • Publication number 20160135288
    • Publication date May 12, 2016
    • Alcatel-Lucent Canada, Inc.
    • PAUL J. BROWN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY
    • Publication number 20150092373
    • Publication date Apr 2, 2015
    • ALCATEL-LUCENT CANADA INC.
    • Alex CHAN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    DE-POP ON-DEVICE DECOUPLING FOR BGA
    • Publication number 20150001716
    • Publication date Jan 1, 2015
    • ALCATEL-LUCENT CANADA, INC.
    • Alex Chan
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    THERMAL WARP COMPENSATION IC PACKAGE
    • Publication number 20130113067
    • Publication date May 9, 2013
    • Alcatel-Lucent Canada Inc.
    • Paul James BROWN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IN-GRID ON-DEVICE DECOUPLING FOR BGA
    • Publication number 20130062762
    • Publication date Mar 14, 2013
    • ALCATEL-LUCENT CANADA, INC.
    • Alex Chan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DE-POP ON-DEVICE DECOUPLING FOR BGA
    • Publication number 20130062763
    • Publication date Mar 14, 2013
    • ALCATEL-LUCENT CANADA, INC.
    • Alex CHAN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    0201 LAND PATTERN FOR 1.0 mm AND .08 mm PITCH ARRAYS
    • Publication number 20120168216
    • Publication date Jul 5, 2012
    • ALCATEL-LUCENT CANADA INC.
    • Alex Chan
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    THERMAL WARP COMPENSATION IC PACKAGE
    • Publication number 20120081872
    • Publication date Apr 5, 2012
    • ALCATEL-LUCENT CANADA INC.
    • Paul James BROWN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WARP REACTIVE IC PACKAGE
    • Publication number 20120081871
    • Publication date Apr 5, 2012
    • ALCATEL-LUCENT CANADA INC.
    • Paul James Brown
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC PACKAGE STIFFENER WITH BEAM
    • Publication number 20110235304
    • Publication date Sep 29, 2011
    • ALCATEL-LUCENT CANADA, INC.
    • Paul J. Brown
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REMOVABLE IC PACKAGE STIFFENING BRACE AND METHOD
    • Publication number 20110235283
    • Publication date Sep 29, 2011
    • ALCATEL-LUCENT CANADA, INC.
    • Paul J. Brown
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    In-grid decoupling for ball grid array (BGA) devices
    • Publication number 20080205011
    • Publication date Aug 28, 2008
    • Alex Chan
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Off-grid decoupling of ball grid array (BGA) devices and method
    • Publication number 20060166398
    • Publication date Jul 27, 2006
    • ALCATEL
    • Alex L. Chan
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Shared via decoupling for area arrays components
    • Publication number 20050162839
    • Publication date Jul 28, 2005
    • ALCATEL
    • Alex L. Chan
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...