Alex Niu

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Songjiang, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for packaging ultra-thin chip with solder ball thermo-compre...
- Patent number 8,563,417
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...
- Publication number 20130130443
- Publication date May 23, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS