Alexander Ciliox

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Mohensee, DE

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Patents Grantslast 30 patents

Information Patent Grant
Die fixing method and apparatus
- Patent number 8,691,624
- Issue date Apr 8, 2014
- Infineon Technologies AG
- Alexander Ciliox
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device including excess solder
- Patent number 8,466,548
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method
- Patent number 8,134,838
- Issue date Mar 13, 2012
- Infineon Technologies AG
- Mark Essert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit-connection
- Patent number 7,494,389
- Issue date Feb 24, 2009
- Infineon Technologies AG
- Mark Essert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating a Substrate with a Solder Stop Structure, Su...
- Publication number 20220278026
- Publication date Sep 1, 2022
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SI...
- Publication number 20150257280
- Publication date Sep 10, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Ciliox
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Die Fixing Method and Apparatus
- Publication number 20130137215
- Publication date May 30, 2013
- Alexander Ciliox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER
- Publication number 20120306087
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD
- Publication number 20100014269
- Publication date Jan 21, 2010
- INFINEON TECHNOLOGIES AG
- Mark Essert
- H01 - BASIC ELECTRIC ELEMENTS