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Alexander Heilmaier
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Haiming, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Method for polishing a semiconductor wafer
Patent number
10,189,142
Issue date
Jan 29, 2019
Siltronic AG
Klaus Roettger
B24 - GRINDING POLISHING
Information
Patent Grant
Method for polishing semiconductor wafers by means of simultaneous...
Patent number
9,221,149
Issue date
Dec 29, 2015
Siltronic AG
Rainer Baumann
B24 - GRINDING POLISHING
Information
Patent Grant
Method for producing a semiconductor wafer
Patent number
8,242,020
Issue date
Aug 14, 2012
Siltronic AG
Klaus Roettger
B24 - GRINDING POLISHING
Information
Patent Grant
Method for simultaneously slicing at least two cylindrical workpiec...
Patent number
7,766,724
Issue date
Aug 3, 2010
Siltronic AG
Anton Huber
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method for removing material from a semiconductor wafer
Patent number
7,108,583
Issue date
Sep 19, 2006
Siltronic AG
Alexander Heilmaier
B24 - GRINDING POLISHING
Information
Patent Grant
Double-sided polishing process for producing a multiplicity of sili...
Patent number
6,861,360
Issue date
Mar 1, 2005
Siltronic AG
Guido Wenski
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR POLISHING A SEMICONDUCTIOR WAFER
Publication number
20220080549
Publication date
Mar 17, 2022
Siltronic AG
Alexander HEILMAIER
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR POLISHING SEMICONDUCTOR WAFERS BY MEANS OF SIMULTANEOUS...
Publication number
20140308878
Publication date
Oct 16, 2014
Siltronic AG
Rainer Baumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
Publication number
20140206261
Publication date
Jul 24, 2014
Siltronic AG
Klaus Roettger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTA...
Publication number
20140141613
Publication date
May 22, 2014
Siltronic AG
Alexander Heilmaier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
Publication number
20100055908
Publication date
Mar 4, 2010
Siltronic AG
Klaus Roettger
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIEC...
Publication number
20080099006
Publication date
May 1, 2008
Siltronic AG
Anton Huber
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR WAFER
Publication number
20060211338
Publication date
Sep 21, 2006
Silitronic AG
Alexander Heilmaier
B24 - GRINDING POLISHING
Information
Patent Application
Silicon semiconductor wafer, and process for producing a multiplici...
Publication number
20030109139
Publication date
Jun 12, 2003
Guido Wenski
B24 - GRINDING POLISHING