Alexander Heinrich

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 12,261,144
- Issue date Mar 25, 2025
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,817,417
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform diffusion soldering
- Patent number 11,605,608
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for operating one or more windows installed in a vehicle
- Patent number 11,584,200
- Issue date Feb 21, 2023
- Continental Automotive GmbH
- Annette Hebling
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solder material with two different size nickel particles
- Patent number 11,552,042
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for controlling a locking element of a vehicle
- Patent number 11,518,341
- Issue date Dec 6, 2022
- Continental Automotive GmbH
- Alexander Heinrich
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Position-based access verification method
- Patent number 11,451,941
- Issue date Sep 20, 2022
- CONTINENTAL AUTOMOTIVE GmbH
- Franz Heininger
- G07 - CHECKING-DEVICES
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for verifying a predefined maximum spatial distance of a rad...
- Patent number 11,217,047
- Issue date Jan 4, 2022
- CONTINENTAL AUTOMOTIVE GmbH
- Franz Plattner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Access arrangement for a vehicle
- Patent number 11,192,525
- Issue date Dec 7, 2021
- Continental Automotive GmbH
- Ulrich Emmerling
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Access arrangement for a vehicle
- Patent number 11,155,240
- Issue date Oct 26, 2021
- Continental Automotive GmbH
- Ulrich Emmerling
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Batch diffusion soldering and electronic devices produced by batch...
- Patent number 11,158,602
- Issue date Oct 26, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly and method of manufacturing thereof
- Patent number 11,004,823
- Issue date May 11, 2021
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, AND METHOD OF FORMING A LAYER STR...
- Publication number 20250100088
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTING OF DIFFUSION SOLDER
- Publication number 20240379615
- Publication date Nov 14, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...
- Publication number 20240297111
- Publication date Sep 5, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
- Publication number 20230420334
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369166
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS ARRANGEMENT FOR A VEHICLE
- Publication number 20230211752
- Publication date Jul 6, 2023
- Continental Automotive Technologies GmbH
- Ulrich Emmerling
- B60 - VEHICLES IN GENERAL
Information Patent Application
OPTOELECTRONIC ASSEMBLY
- Publication number 20230178696
- Publication date Jun 8, 2023
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE
- Publication number 20230126663
- Publication date Apr 27, 2023
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
- Publication number 20230130092
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOL...
- Publication number 20220355422
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...
- Publication number 20220310435
- Publication date Sep 29, 2022
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20220108974
- Publication date Apr 7, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20220046792
- Publication date Feb 10, 2022
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...
- Publication number 20210375824
- Publication date Dec 2, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Material, Layer Structure, Chip Package, Method of Forming a...
- Publication number 20210183804
- Publication date Jun 17, 2021
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Preform Diffusion Soldering
- Publication number 20210143120
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Diffusion Soldering and Electronic Devices Produced by Batch...
- Publication number 20210143123
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Heinrich

Person

Patents Grantslast 30 patents

Semiconductor device and method for fabricating a semiconductor device

Electronic device with multi-layer contact and system

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor device having a soldered joint with one or more inter...

Pre-plating of solder layer on solderable elements for diffusion so...

Layer structure with an intermetallic phase layer and a chip packag...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Method of forming a chip package and chip package

Electronic device with multi-layer contact and system

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device including a solder compound containing a compo...

Semiconductor package and method for fabricating a semiconductor pa...

Flat lead package formation method

Preform diffusion soldering

Arrangement for operating one or more windows installed in a vehicle

Solder material with two different size nickel particles

Method for controlling a locking element of a vehicle

Chip assembly

Soldering a conductor to an aluminum metallization

Position-based access verification method

Soldering a conductor to an aluminum layer

Multi-purpose non-linear semiconductor package assembly line

Method for verifying a predefined maximum spatial distance of a rad...

Access arrangement for a vehicle

Access arrangement for a vehicle

Batch diffusion soldering and electronic devices produced by batch...

Semiconductor device including a solder compound containing a compo...

Chip assembly and method of manufacturing thereof

Chip arrangements

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

SOLDER MATERIAL, LAYER STRUCTURE, AND METHOD OF FORMING A LAYER STR...

INKJET PRINTING OF DIFFUSION SOLDER

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Semiconductor Device and Method for Fabricating a Semiconductor Device

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

ACCESS ARRANGEMENT FOR A VEHICLE

OPTOELECTRONIC ASSEMBLY

LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE

SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOL...

METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...

Power Semiconductor Device and Method for Fabricating a Power Semic...

Solder Material, Layer Structure, Chip Package, Method of Forming a...

CHIP ARRANGEMENTS

Preform Diffusion Soldering

Batch Diffusion Soldering and Electronic Devices Produced by Batch...