Alexander Heinrich

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,817,417
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform diffusion soldering
- Patent number 11,605,608
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for operating one or more windows installed in a vehicle
- Patent number 11,584,200
- Issue date Feb 21, 2023
- Continental Automotive GmbH
- Annette Hebling
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solder material with two different size nickel particles
- Patent number 11,552,042
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for controlling a locking element of a vehicle
- Patent number 11,518,341
- Issue date Dec 6, 2022
- Continental Automotive GmbH
- Alexander Heinrich
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Position-based access verification method
- Patent number 11,451,941
- Issue date Sep 20, 2022
- CONTINENTAL AUTOMOTIVE GmbH
- Franz Heininger
- G07 - CHECKING-DEVICES
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for verifying a predefined maximum spatial distance of a rad...
- Patent number 11,217,047
- Issue date Jan 4, 2022
- CONTINENTAL AUTOMOTIVE GmbH
- Franz Plattner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Access arrangement for a vehicle
- Patent number 11,192,525
- Issue date Dec 7, 2021
- Continental Automotive GmbH
- Ulrich Emmerling
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Access arrangement for a vehicle
- Patent number 11,155,240
- Issue date Oct 26, 2021
- Continental Automotive GmbH
- Ulrich Emmerling
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Batch diffusion soldering and electronic devices produced by batch...
- Patent number 11,158,602
- Issue date Oct 26, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly and method of manufacturing thereof
- Patent number 11,004,823
- Issue date May 11, 2021
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INKJET PRINTING OF DIFFUSION SOLDER
- Publication number 20240379615
- Publication date Nov 14, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...
- Publication number 20240297111
- Publication date Sep 5, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
- Publication number 20230420334
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369166
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS ARRANGEMENT FOR A VEHICLE
- Publication number 20230211752
- Publication date Jul 6, 2023
- Continental Automotive Technologies GmbH
- Ulrich Emmerling
- B60 - VEHICLES IN GENERAL
Information Patent Application
OPTOELECTRONIC ASSEMBLY
- Publication number 20230178696
- Publication date Jun 8, 2023
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE
- Publication number 20230126663
- Publication date Apr 27, 2023
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
- Publication number 20230130092
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOL...
- Publication number 20220355422
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...
- Publication number 20220310435
- Publication date Sep 29, 2022
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20220108974
- Publication date Apr 7, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20220046792
- Publication date Feb 10, 2022
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...
- Publication number 20210375824
- Publication date Dec 2, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Material, Layer Structure, Chip Package, Method of Forming a...
- Publication number 20210183804
- Publication date Jun 17, 2021
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Preform Diffusion Soldering
- Publication number 20210143120
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Diffusion Soldering and Electronic Devices Produced by Batch...
- Publication number 20210143123
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20210134708
- Publication date May 6, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnection between an Electric Component...
- Publication number 20210118842
- Publication date Apr 22, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Heinrich

Person

Patents Grantslast 30 patents

Pre-plating of solder layer on solderable elements for diffusion so...

Layer structure with an intermetallic phase layer and a chip packag...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Method of forming a chip package and chip package

Electronic device with multi-layer contact and system

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device including a solder compound containing a compo...

Semiconductor package and method for fabricating a semiconductor pa...

Flat lead package formation method

Preform diffusion soldering

Arrangement for operating one or more windows installed in a vehicle

Solder material with two different size nickel particles

Method for controlling a locking element of a vehicle

Chip assembly

Soldering a conductor to an aluminum metallization

Position-based access verification method

Soldering a conductor to an aluminum layer

Multi-purpose non-linear semiconductor package assembly line

Method for verifying a predefined maximum spatial distance of a rad...

Access arrangement for a vehicle

Access arrangement for a vehicle

Batch diffusion soldering and electronic devices produced by batch...

Semiconductor device including a solder compound containing a compo...

Chip assembly and method of manufacturing thereof

Chip arrangements

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Package with vertical interconnect between carrier and clip

Chip assembly

Patents Applicationslast 30 patents

INKJET PRINTING OF DIFFUSION SOLDER

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Semiconductor Device and Method for Fabricating a Semiconductor Device

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

ACCESS ARRANGEMENT FOR A VEHICLE

OPTOELECTRONIC ASSEMBLY

LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE

SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOL...

METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...

Power Semiconductor Device and Method for Fabricating a Power Semic...

Solder Material, Layer Structure, Chip Package, Method of Forming a...

CHIP ARRANGEMENTS

Preform Diffusion Soldering

Batch Diffusion Soldering and Electronic Devices Produced by Batch...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Method of Forming an Interconnection between an Electric Component...