Alexander Helmut PFEIFFENBERGER

Person

Toronto, CA

People

Patents Applicationslast 30 patents

Information Patent Application
Chip with Top Metal Pad Pitch Adjustment
- Publication number 20250096100
- Publication date Mar 20, 2025
- Tenstorrent Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN...
- Publication number 20250098184
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGR...
- Publication number 20250096161
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE
- Publication number 20240274549
- Publication date Aug 15, 2024
- ADVANCED MICRO DEVICES, INC.
- Alexander Helmut Pfeiffenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
- Publication number 20240234304
- Publication date Jul 11, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MAGNETIC INDUCTOR
- Publication number 20240212908
- Publication date Jun 27, 2024
- ADVANCED MICRO DEVICES, INC.
- Robert Grant Spurney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE
- Publication number 20240178087
- Publication date May 30, 2024
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Helmut PFEIFFENBERGER

Person

Patents Applicationslast 30 patents

Chip with Top Metal Pad Pitch Adjustment

HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN...

METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGR...

SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

THROUGH-MAGNETIC INDUCTOR

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE