Alexander Herbrandt

Person

Warstein, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module arrangement and method for producing a p...
- Patent number 12,041,755
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Regina Nottelmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Housing for a power semiconductor module arrangement
- Patent number 11,856,718
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density and durable semiconductor device interconnect
- Patent number 11,756,923
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and a method for producing a power semic...
- Patent number 11,533,824
- Issue date Dec 20, 2022
- Infineon Technologies AG
- Regina Nottelmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with an electrically conductive press-fit termina...
- Patent number 11,114,780
- Issue date Sep 7, 2021
- Infineon Technologies AG
- Katharina Teichmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically connecting an electronic module and electro...
- Patent number 10,693,248
- Issue date Jun 23, 2020
- Infineon Technologies AG
- Katharina Teichmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directly cooled substrates for semiconductor modules and correspond...
- Patent number 9,731,370
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, chip arrangement, and method for manufacturing the same
- Patent number 9,585,241
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with directly attached thermally conductive structures
- Patent number 8,872,332
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT PIN CONFIGURATIONS FOR POWER SEMICONDUCTOR MODULES
- Publication number 20240266765
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Regina Nottelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Press-Fit Connector and Receptacle
- Publication number 20240039189
- Publication date Feb 1, 2024
- Regina Nottelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING FOR A POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20230180400
- Publication date Jun 8, 2023
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING A P...
- Publication number 20230124688
- Publication date Apr 20, 2023
- Regina Nottelmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT
- Publication number 20230063259
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND A METHOD FOR PRODUCING A POWER SEMIC...
- Publication number 20210400838
- Publication date Dec 23, 2021
- Regina Nottelmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module with an Electrically Conductive Press-Fit Termina...
- Publication number 20200251839
- Publication date Aug 6, 2020
- Katharina Teichmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Electrically Connecting an Electronic Module and Electro...
- Publication number 20180337475
- Publication date Nov 22, 2018
- INFINEON TECHNOLOGIES AG
- Katharina Teichmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Directly Cooled Substrates for Semiconductor Modules
- Publication number 20170304922
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150085446
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Directly Cooled Substrates for Semiconductor Modules and Correspond...
- Publication number 20140321063
- Publication date Oct 30, 2014
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Module with Directly Attached Thermally Conductive Structures
- Publication number 20130285234
- Publication date Oct 31, 2013
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Herbrandt

Person

Patents Grantslast 30 patents

Power semiconductor module arrangement and method for producing a p...

Housing for a power semiconductor module arrangement

High density and durable semiconductor device interconnect

Power semiconductor module and a method for producing a power semic...

Electronic module with an electrically conductive press-fit termina...

Method for electrically connecting an electronic module and electro...

Directly cooled substrates for semiconductor modules and correspond...

Substrate, chip arrangement, and method for manufacturing the same

Power module with cooling structure on bonding substrate for coolin...

Power module with directly attached thermally conductive structures

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

PRESS-FIT PIN CONFIGURATIONS FOR POWER SEMICONDUCTOR MODULES

Press-Fit Connector and Receptacle

HOUSING FOR A POWER SEMICONDUCTOR MODULE ARRANGEMENT

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING A P...

HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT

POWER SEMICONDUCTOR MODULE AND A METHOD FOR PRODUCING A POWER SEMIC...

Electronic Module with an Electrically Conductive Press-Fit Termina...

Method for Electrically Connecting an Electronic Module and Electro...

Directly Cooled Substrates for Semiconductor Modules

SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME

Power module with cooling structure on bonding substrate for coolin...

Directly Cooled Substrates for Semiconductor Modules and Correspond...

Power Module with Directly Attached Thermally Conductive Structures