Alexander Komposch

Person

Morgan Hill, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, and package molds for forming packa...
- Patent number 12,119,239
- Issue date Oct 15, 2024
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifiers having shielded transmission line structures
- Patent number 12,034,419
- Issue date Jul 9, 2024
- MACOM Technology Solutions Holdings, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming packaged semiconductor devices and leadframes fo...
- Patent number 12,009,286
- Issue date Jun 11, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for RF transistor amplifiers
- Patent number 11,837,457
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor having die attach materials with channels and p...
- Patent number 11,830,810
- Issue date Nov 28, 2023
- Wolfspeed, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,688,673
- Issue date Jun 27, 2023
- Wolfspeed, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including interconnect structures and methods...
- Patent number 11,670,605
- Issue date Jun 6, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) transistor amplifier packages with improved is...
- Patent number 11,581,859
- Issue date Feb 14, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-zone radio frequency transistor amplifiers
- Patent number 11,533,024
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cavity package having single metal flange
- Patent number 11,437,362
- Issue date Sep 6, 2022
- Wolfspeed, Inc.
- Saurabh Goel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having die attach materials with channels and pr...
- Patent number 11,424,177
- Issue date Aug 23, 2022
- Wolfspeed, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency amplifiers having improved shunt matching circuits
- Patent number 11,367,696
- Issue date Jun 21, 2022
- Wolfspeed, Inc.
- Simon Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifiers having shielded transmission line structures
- Patent number 11,356,070
- Issue date Jun 7, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for dicing semiconductor wafers and semiconductor devices m...
- Patent number 11,289,378
- Issue date Mar 29, 2022
- Wolfspeed, Inc.
- Kevin Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device carrier configured for interconnects, a package implementing...
- Patent number 11,257,740
- Issue date Feb 22, 2022
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 11,004,808
- Issue date May 11, 2021
- Cree, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cavity package having single metal flange
- Patent number 10,468,399
- Issue date Nov 5, 2019
- Cree, Inc.
- Saurabh Goel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package having different types of semiconductor dies atta...
- Patent number 9,997,476
- Issue date Jun 12, 2018
- Infineon Technologies AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor package
- Patent number 9,373,577
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Alexander Komposch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package having a baseplate with a die attach region a...
- Patent number 9,293,407
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having asymmetric chip mounting area a...
- Patent number 9,209,116
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Alexander Komposch
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
PCB based RF-power package window frame
- Patent number 8,907,467
- Issue date Dec 9, 2014
- Infineon Technologies AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
- Publication number 20240421053
- Publication date Dec 19, 2024
- Qianli MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Improved Thermal and Electrical Conductivity Between Metal Contacts
- Publication number 20240410939
- Publication date Dec 12, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20240282679
- Publication date Aug 22, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
- Publication number 20240171137
- Publication date May 23, 2024
- MACOM Technology Solutions Holdings, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE
- Publication number 20240105570
- Publication date Mar 28, 2024
- WOLFSPEED, INC.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS
- Publication number 20240105692
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Woo Eng Wah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS...
- Publication number 20240079320
- Publication date Mar 7, 2024
- Wolfspeed, Inc.
- Mitch FLOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...
- Publication number 20230421119
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERC...
- Publication number 20230420430
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Qianli Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE HAVING CONNECTED COMPONENTS AND PROCESSES IMPLEMENTIN...
- Publication number 20230402360
- Publication date Dec 14, 2023
- Wolfspeed, Inc.
- Alexander KOMPOSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULAR...
- Publication number 20230327624
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING A METAL STACK
- Publication number 20230253359
- Publication date Aug 10, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICON...
- Publication number 20230162991
- Publication date May 25, 2023
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20230117260
- Publication date Apr 20, 2023
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...
- Publication number 20220399318
- Publication date Dec 15, 2022
- Cree, Inc.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Cavity Package Having Single Metal Flange
- Publication number 20220352141
- Publication date Nov 3, 2022
- Wolfspeed, Inc.
- Saurabh Goel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULAR...
- Publication number 20220321071
- Publication date Oct 6, 2022
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURES
- Publication number 20220263482
- Publication date Aug 18, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DICING SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES M...
- Publication number 20220216108
- Publication date Jul 7, 2022
- Wolfspeed, Inc.
- Kevin SCHNEIDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED RF POWER DEVICE WITH PCB ROUTING
- Publication number 20220157671
- Publication date May 19, 2022
- Cree, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING FOR RF TRANSISTOR AMPLIFIERS
- Publication number 20220084950
- Publication date Mar 17, 2022
- Cree, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20220028821
- Publication date Jan 27, 2022
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
- Publication number 20210408976
- Publication date Dec 30, 2021
- Cree, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) TRANSISTOR AMPLIFIER PACKAGES WITH IMPROVED IS...
- Publication number 20210408979
- Publication date Dec 30, 2021
- Cree, Inc.
- Alexander Komposch
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURES
- Publication number 20210376807
- Publication date Dec 2, 2021
- Cree, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Transistor with Channeled Die Attach Materials and Process...
- Publication number 20210351121
- Publication date Nov 11, 2021
- Cree, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having Die Attach Materials with Channels and Pr...
- Publication number 20210351113
- Publication date Nov 11, 2021
- Cree, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING
- Publication number 20210313282
- Publication date Oct 7, 2021
- Cree, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING
- Publication number 20210313293
- Publication date Oct 7, 2021
- Cree, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Komposch

Person

Patents Grantslast 30 patents

RF amplifier devices including top side contacts and methods of man...

Packaged semiconductor devices, and package molds for forming packa...

Packaged RF power device with PCB routing outside protective member

Package with different types of semiconductor dies attached to a fl...

Contact and die attach metallization for silicon carbide based devi...

RF amplifiers having shielded transmission line structures

Methods of forming packaged semiconductor devices and leadframes fo...

Integrated passive device (IPD) components and a package and proces...

Packaging for RF transistor amplifiers

Packaged transistor having die attach materials with channels and p...

Integrated passive device (IPD) components and a package and proces...

RF amplifier devices including interconnect structures and methods...

Radio frequency (RF) transistor amplifier packages with improved is...

Multi-zone radio frequency transistor amplifiers

High reliability semiconductor devices and methods of fabricating t...

Multi-cavity package having single metal flange

Die-attach method to compensate for thermal expansion

Integrated circuit having die attach materials with channels and pr...

Radio frequency amplifiers having improved shunt matching circuits

RF amplifiers having shielded transmission line structures

Methods for dicing semiconductor wafers and semiconductor devices m...

Device carrier configured for interconnects, a package implementing...

Contact and die attach metallization for silicon carbide based devi...

Package with different types of semiconductor dies attached to a fl...

Multi-cavity package having single metal flange

Multi-die package having different types of semiconductor dies atta...

Hybrid semiconductor package

Semiconductor package having a baseplate with a die attach region a...

Semiconductor device package having asymmetric chip mounting area a...

PCB based RF-power package window frame

Patents Applicationslast 30 patents

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

Improved Thermal and Electrical Conductivity Between Metal Contacts

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE

PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS

PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS...

SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...

MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERC...

POWER PACKAGE HAVING CONNECTED COMPONENTS AND PROCESSES IMPLEMENTIN...

RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULAR...

SEMICONDUCTOR DIE INCLUDING A METAL STACK

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICON...

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...

Multi-Cavity Package Having Single Metal Flange

RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULAR...

RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURES

METHODS FOR DICING SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES M...

PACKAGED RF POWER DEVICE WITH PCB ROUTING

PACKAGING FOR RF TRANSISTOR AMPLIFIERS

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

RADIO FREQUENCY (RF) TRANSISTOR AMPLIFIER PACKAGES WITH IMPROVED IS...

RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURES

Packaged Transistor with Channeled Die Attach Materials and Process...

Integrated Circuit Having Die Attach Materials with Channels and Pr...

RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING

RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING