Alexander LANDEL

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Munchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Variation of metal layer stack under under bump metallization (UBM)
- Patent number 11,894,829
- Issue date Feb 6, 2024
- RF360 SINGAPORE PTE. LTD.
- Ute Steinhaeusser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VARIATION OF METAL LAYER STACK UNDER UNDER BUMP METALLIZATION (UBM)
- Publication number 20210143790
- Publication date May 13, 2021
- RF360 Europe GmbH
- Ute STEINHAEUSSER
- H01 - BASIC ELECTRIC ELEMENTS