Alexander M. Arayata

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame for semiconductor package with enhanced stress relief
- Patent number 8,836,091
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for high pressure sensor device
- Patent number 8,686,550
- Issue date Apr 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF
- Publication number 20140264793
- Publication date Sep 18, 2014
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE
- Publication number 20130207207
- Publication date Aug 15, 2013
- William G. McDonald
- B60 - VEHICLES IN GENERAL