Alexander Platz

Person

Ebersbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming bump structures that include a protection layer
- Patent number 8,580,672
- Issue date Nov 12, 2013
- GLOBALFOUNDRIES Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a reduced stress configuration for m...
- Patent number 8,039,958
- Issue date Oct 18, 2011
- Advanced Micro Devices, Inc.
- Alexander Platz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder balls with a stable oxide layer by contro...
- Patent number 7,829,453
- Issue date Nov 9, 2010
- GLOBALFOUNDRIES Inc.
- Gotthard Jungnickel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for efficiently patterning an underbump metallization lay...
- Patent number 7,585,759
- Issue date Sep 8, 2009
- Advanced Micro Devices, Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROT...
- Publication number 20140021604
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Bump Structures That Include a Protection Layer
- Publication number 20130099372
- Publication date Apr 25, 2013
- GLOBALFOUNDRIES INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Die Seal with Graded Pattern Density
- Publication number 20110291285
- Publication date Dec 1, 2011
- GLOBALFOUNDRIES INC.
- Guido Ueberreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNEC...
- Publication number 20100164098
- Publication date Jul 1, 2010
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A REDUCED STRESS CONFIGURATION FOR M...
- Publication number 20100109158
- Publication date May 6, 2010
- Alexander Platz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
- Publication number 20080099913
- Publication date May 1, 2008
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTRO...
- Publication number 20070123020
- Publication date May 31, 2007
- Gotthard Jungnickel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUE FOR EFFICIENTLY PATTERNING AN UNDERBUMP METALLIZATION LAY...
- Publication number 20070023928
- Publication date Feb 1, 2007
- FRANK KUECHENMEISTER
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Platz

Person

Patents Grantslast 30 patents

Methods of forming bump structures that include a protection layer

Semiconductor device including a reduced stress configuration for m...

Method for forming solder balls with a stable oxide layer by contro...

Technique for efficiently patterning an underbump metallization lay...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROT...

Methods of Forming Bump Structures That Include a Protection Layer

Semiconductor Device Comprising a Die Seal with Graded Pattern Density

SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNEC...

SEMICONDUCTOR DEVICE INCLUDING A REDUCED STRESS CONFIGURATION FOR M...

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTRO...

TECHNIQUE FOR EFFICIENTLY PATTERNING AN UNDERBUMP METALLIZATION LAY...