Alexander SCHWARZ

Person

Soest, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,589,922
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, chip arrangement, and method for manufacturing the same
- Patent number 9,585,241
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170154835
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cold Plate, Device Comprising a Cold Plate and Method for Fabricati...
- Publication number 20160056088
- Publication date Feb 25, 2016
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier, Semiconductor Module and Fabrication Method Thereof
- Publication number 20160021780
- Publication date Jan 21, 2016
- INFINEON TECHNOLOGIES AG
- Alexander Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150264796
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150085446
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING MODULES OF POWER SEMICONDUCTOR DEVICE
- Publication number 20140291832
- Publication date Oct 2, 2014
- INFINEON TECHNOLOGIES AG
- Alexander Schwarz
- H01 - BASIC ELECTRIC ELEMENTS

Alexander SCHWARZ

Person

Patents Grantslast 30 patents

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Power module with cooling structure on bonding substrate for coolin...

Patents Applicationslast 30 patents

Electronic module and method of manufacturing the same

Cold Plate, Device Comprising a Cold Plate and Method for Fabricati...

Carrier, Semiconductor Module and Fabrication Method Thereof

Electronic module and method of manufacturing the same

SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME

Power module with cooling structure on bonding substrate for coolin...

INTEGRATED COOLING MODULES OF POWER SEMICONDUCTOR DEVICE