Alexander Simpson

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polyelectrolyte dispensing polishing pad
- Patent number 7,011,574
- Issue date Mar 14, 2006
- Infineon Technologies AG
- Alexander William Simpson
- B24 - GRINDING POLISHING
Information Patent Grant
Polyelectrolyte dispensing polishing pad, production thereof and me...
- Patent number 6,841,480
- Issue date Jan 11, 2005
- Infineon Technologies AG
- Alexander William Simpson
- B24 - GRINDING POLISHING
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,740,539
- Issue date May 25, 2004
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,570,256
- Issue date May 27, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry-less chemical-mechanical polishing
- Patent number 6,569,769
- Issue date May 27, 2003
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase removal rate of oxide using fixed-abrasive
- Patent number 6,485,355
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Laertis Economikos
- B24 - GRINDING POLISHING
Information Patent Grant
Increased polish removal rate of dielectric layers using fixed abra...
- Patent number 6,350,692
- Issue date Feb 26, 2002
- Infineon Technologies AG
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry-less chemical-mechanical polishing
- Patent number 6,294,470
- Issue date Sep 25, 2001
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Polyelectrolyte dispensing polishing pad
- Publication number 20050153643
- Publication date Jul 14, 2005
- Alexander William Simpson
- B24 - GRINDING POLISHING
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030153198
- Publication date Aug 14, 2003
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polyelectrolyte dispensing polishing pad, production thereof and me...
- Publication number 20030148614
- Publication date Aug 7, 2003
- Alexander William Simpson
- B24 - GRINDING POLISHING
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030017642
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO INCREASE REMOVAL RATE OF OXIDE USING FIXED-ABRASIVE
- Publication number 20020197937
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Laertis Economikos
- B24 - GRINDING POLISHING

Alexander Simpson

Person

Patents Grantslast 30 patents

Polyelectrolyte dispensing polishing pad

Polyelectrolyte dispensing polishing pad, production thereof and me...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Slurry-less chemical-mechanical polishing

Method to increase removal rate of oxide using fixed-abrasive

Increased polish removal rate of dielectric layers using fixed abra...

Slurry-less chemical-mechanical polishing

Patents Applicationslast 30 patents

Polyelectrolyte dispensing polishing pad

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Polyelectrolyte dispensing polishing pad, production thereof and me...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

METHOD TO INCREASE REMOVAL RATE OF OXIDE USING FIXED-ABRASIVE