Alexander Simpson

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Warrenville, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of determining the endpoint of a planarization process
- Patent number 6,932,674
- Issue date Aug 23, 2005
- Infineon Technologies Aktientgesellschaft
- Peter Lahnor
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing (CMP) process using fixed abrasive pads
- Patent number 6,899,597
- Issue date May 31, 2005
- Infineon Technologies AG
- Peter Wrschka
- B24 - GRINDING POLISHING
Information Patent Grant
Defect-minimizing, topology-independent planarization of process su...
- Patent number 6,893,968
- Issue date May 17, 2005
- Infineon Technologies AG
- Peter Lahnor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing substrates
- Patent number 6,827,635
- Issue date Dec 7, 2004
- Infineon Technologies Aktiengesellschaft
- Peter Lahnor
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Chemical mechanical polishing (CMP) process using fixed abrasive pads
- Publication number 20050014454
- Publication date Jan 20, 2005
- Infineon Technologies North America Corp.
- Peter Wrschka
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PLANARIZING SUBSTRATES
- Publication number 20040185756
- Publication date Sep 23, 2004
- Peter Lahnor
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DETERMINING THE ENDPOINT OF A PLANARIZATION PROCESS
- Publication number 20040176015
- Publication date Sep 9, 2004
- Peter Lahnor
- B24 - GRINDING POLISHING
Information Patent Application
Defect-minimizing, topology-independent planarization of process su...
- Publication number 20030190809
- Publication date Oct 9, 2003
- Peter Lahnor
- H01 - BASIC ELECTRIC ELEMENTS