Alexander Wehner

Person

Nuremberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 12,199,021
- Issue date Jan 14, 2025
- Semikron Elektronik GmbH & Co. KG
- Manuel Noderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing device for directly or indirectly applying pressure to pow...
- Patent number 12,094,797
- Issue date Sep 17, 2024
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor arrangement having a cover facility and method...
- Patent number 12,096,577
- Issue date Sep 17, 2024
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus Beck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module having a DC voltage connecting device
- Patent number 12,062,601
- Issue date Aug 13, 2024
- Semikron Elektronik GmbH & Co. KG
- Manuel Noderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic switching device, power semiconductor module there...
- Patent number 11,800,644
- Issue date Oct 24, 2023
- Semikron Elektronik GmbH & Co. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics submodule for mounting on a cooling device
- Patent number 11,533,822
- Issue date Dec 20, 2022
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with press-fit contact element
- Patent number 11,387,588
- Issue date Jul 12, 2022
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering procedure in which power semiconductor component...
- Patent number 10,957,560
- Issue date Mar 23, 2021
- Semikron Elektronik GmbH & Co. KG
- Alexander Wehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics submodule having DC and AC voltage terminal eleme...
- Patent number 10,270,358
- Issue date Apr 23, 2019
- Semikron Elektronik GmbH & Co. KG
- Harald Kobolla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronic arrangement with DC voltage connection element
- Patent number 10,090,774
- Issue date Oct 2, 2018
- Semikron Elektronik GmbH & Co. KG
- Peter Beckedahl
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A DC VOLTAGE CONNECTING DEVICE
- Publication number 20230112316
- Publication date Apr 13, 2023
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Manuel NODERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POW...
- Publication number 20220406674
- Publication date Dec 22, 2022
- Ingo BOGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20220384394
- Publication date Dec 1, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- MANUEL SCHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A POWER SEMICON...
- Publication number 20220301998
- Publication date Sep 22, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Manuel NODERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SWITCHING DEVICE, POWER SEMICONDUCTOR MODULE THERE...
- Publication number 20220046798
- Publication date Feb 10, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Markus Düsel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE
- Publication number 20210391229
- Publication date Dec 16, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH PRESS-FIT CONTACT ELEMENT
- Publication number 20210336370
- Publication date Oct 28, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Ingo BOGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS SUBMODULE FOR MOUNTING ON A COOLING DEVICE
- Publication number 20210267086
- Publication date Aug 26, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Ingo BOGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SINTERING PROCEDURE IN WHICH POWER SEMICONDUCTOR COMPONENT...
- Publication number 20190333781
- Publication date Oct 31, 2019
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- ALEXANDER WEHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS SUBMODULE HAVING DC AND AC VOLTAGE TERMINAL ELEME...
- Publication number 20190020285
- Publication date Jan 17, 2019
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Harald KOBOLLA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Alexander Wehner

Person

Patents Grantslast 30 patents

Power semiconductor module and method for producing a power semicon...

Pressing device for directly or indirectly applying pressure to pow...

Power semiconductor arrangement having a cover facility and method...

Power semiconductor module having a DC voltage connecting device

Power electronic switching device, power semiconductor module there...

Power electronics submodule for mounting on a cooling device

Power semiconductor module with press-fit contact element

Pressure sintering procedure in which power semiconductor component...

Power electronics submodule having DC and AC voltage terminal eleme...

Power electronic arrangement with DC voltage connection element

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE HAVING A DC VOLTAGE CONNECTING DEVICE

PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POW...

POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A POWER SEMICON...

POWER ELECTRONIC SWITCHING DEVICE, POWER SEMICONDUCTOR MODULE THERE...

POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE

POWER SEMICONDUCTOR MODULE WITH PRESS-FIT CONTACT ELEMENT

POWER ELECTRONICS SUBMODULE FOR MOUNTING ON A COOLING DEVICE

PRESSURE SINTERING PROCEDURE IN WHICH POWER SEMICONDUCTOR COMPONENT...

POWER ELECTRONICS SUBMODULE HAVING DC AND AC VOLTAGE TERMINAL ELEME...