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Alexandra Efimovskaya
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Irvine, CA, US
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last 30 patents
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Patent Grant
Low cost wafer level process for packaging MEMS three dimensional d...
Patent number
10,167,190
Issue date
Jan 1, 2019
The Regents of the University of California
Andrei A. Shkel
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Through-wafer interconnects for MEMS double-sided fabrication proce...
Patent number
9,611,138
Issue date
Apr 4, 2017
The Regents of the University of California
Andrei A. Shkel
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
LOW COST WAFER LEVEL PROCESS FOR PACKAGING MEMS THREE DIMENSIONAL D...
Publication number
20170233247
Publication date
Aug 17, 2017
The Regents of the University of California
Andrei A. Shkel
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
THROUGH-WAFER INTERCONNECTS FOR MEMS DOUBLE-SIDED FABRICATION PROCE...
Publication number
20160167958
Publication date
Jun 16, 2016
The Regents of the University of California
Andrei A. Shkel
B81 - MICRO-STRUCTURAL TECHNOLOGY