Alexandre Blander

Person

Pierrefonds, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Grounded lid for micro-electronic assemblies
- Patent number 9,042,120
- Issue date May 26, 2015
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,786,059
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounded lid for micro-electronic assemblies
- Patent number 8,614,900
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,236,615
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring thin layers in solid state devices
- Patent number 7,512,518
- Issue date Mar 31, 2009
- International Business Machines Corporation
- Alexandre Blander
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES
- Publication number 20140016283
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20120228748
- Publication date Sep 13, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES
- Publication number 20110292621
- Publication date Dec 1, 2011
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20110121469
- Publication date May 26, 2011
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MEASURING THIN LAYERS IN SOLID STATE DEVICES
- Publication number 20080021673
- Publication date Jan 24, 2008
- Alexandre Blander
- G01 - MEASURING TESTING

Alexandre Blander

Person

Patents Grantslast 30 patents

Grounded lid for micro-electronic assemblies

Additives for grain fragmentation in Pb-free Sn-based solder

Passivation layer surface topography modifications for improved int...

Grounded lid for micro-electronic assemblies

Additives for grain fragmentation in Pb-free Sn-based solder

Passivation layer surface topography modifications for improved int...

Method for measuring thin layers in solid state devices

Patents Applicationslast 30 patents

GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

METHOD FOR MEASURING THIN LAYERS IN SOLID STATE DEVICES