Alexandre Mas

Person

Saint Egreve, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Reading circuit for a pixel array
- Patent number 12,081,888
- Issue date Sep 3, 2024
- STMicroelectronics (Grenoble 2) SAS
- Alexandre Mas
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 11,688,815
- Issue date Jun 27, 2023
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 11,114,312
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 10,833,208
- Issue date Nov 10, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for making a cover for an electronic package and electronic...
- Patent number 10,483,408
- Issue date Nov 19, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 10,325,784
- Issue date Jun 18, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
READING CIRCUIT FOR A PIXEL ARRAY
- Publication number 20220368847
- Publication date Nov 17, 2022
- STMicroelectronics (Grenoble 2) SAS
- Alexandre Mas
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20210043780
- Publication date Feb 11, 2021
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20200020815
- Publication date Jan 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...
- Publication number 20190252212
- Publication date Aug 15, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20180190511
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Alexandre Mas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A GROOVED CHIP
- Publication number 20180190562
- Publication date Jul 5, 2018
- STMicroelectronics (Tours) SAS
- Laurent Figuiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC...
- Publication number 20180190838
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...
- Publication number 20180190512
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS

Alexandre Mas

Person

Patents Grantslast 30 patents

Reading circuit for a pixel array

Method for manufacturing a cover for an electronic package and elec...

Method for manufacturing an encapsulation cover for an electronic p...

Method for manufacturing a cover for an electronic package and elec...

Method for making a cover for an electronic package and electronic...

Method for manufacturing an encapsulation cover for an electronic p...

Patents Applicationslast 30 patents

READING CIRCUIT FOR A PIXEL ARRAY

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

ELECTRONIC DEVICE HAVING A GROOVED CHIP

METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC...

METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...